4 / 47

www.inplay-tech.com

N1EDOC-DS-IN100-EN-V1.3

5. Electrical Characteristic..................................................................... 32

5.1.

Absolute maximum ratings ............................................................................... 32

5.2.

Recommended operating conditions ................................................................ 33

5.3.

GPIO characteristics ......................................................................................... 33

5.4.

RF performance characteristics ....................................................................... 34

5.4.1.

General RF Characteristics......................................................................................................... 34

5.4.2.

RF transmitter performance characteristics.............................................................................. 35

5.5.

System power consumption.............................................................................. 35

5.6.

ESD characteristics (all pins)............................................................................. 36

6. Reference Design ............................................................................... 37

6.1.

IN100 QFN18 reference schematic......................................................................37

6.2.

IN100 DFN8 reference schematic.......................................................................37

7. Layout................................................................................................. 38

7.1.

Layer stack-up ................................................................................................. 38

7.2.

Crystal.............................................................................................................. 38

7.2.1.

26MHz crystal............................................................................................................................. 38

7.2.2.

32.768kHz crystal ....................................................................................................................... 38

7.3.

RF trace............................................................................................................ 39

7.4.

Antenna............................................................................................................ 39

7.5.

Power supply .................................................................................................... 39

7.6.

Thermal PAD vias.............................................................................................. 39

7.7.

GND.................................................................................................................. 39

8. Reflow Profile Information .................................................................40

8.1.

Storage condition ............................................................................................. 40

8.1.1.

Moisture barrier bag storage condition (sealed)..........................................................................40

8.1.2.

Moisture barrier bag when opened ............................................................................................. 40

8.2.

Stencil design................................................................................................... 40

8.3.

Baking conditions ............................................................................................. 40

8.4.

Soldering and reflow condition.......................................................................... 40

8.4.1.

Reflow oven ............................................................................................................................... 40

9. Package Dimension ............................................................................42

9.1.

QFN18 ............................................................................................................... 42

9.2.

DFN8 ................................................................................................................ 44

9.3.

IC marking ........................................................................................................ 46

10. Ordering Information .......................................................................... 47