IN100-Q1-R-RC1F datasheet(40/49 Pages) ETC

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N1EDOC-DS-IN100-EN-V1.3

to reduce the capacitive coupling of unwanted signals to the clock line, the slow clock traces must

not be crossed by other signals.

7.3. RF trace

Place the RF path on the top layer (component side) and keep the trace as short as possible. The

RF trace must be immediately above a continuous ground on the next layer (Layer 2), The

impedance of the RF trace must be controlled to 50 ohms by appropriate adjustment of the line

width for the layer-to-layer separation and dielectric properties of the boards being used. In

addition, ground vias are required for better RF isolation.

7.4. Antenna

The antenna is a key component in wireless system design to make sure the device will perform

as expected. Make sure to select an antenna that covers the appropriate frequency band from

2.350GHz to 2.550GHz. Talk to the antenna supplier and make sure they understand that the

antenna must cover the entire frequency range. Also make sure the antenna is designed for a

50Ω impedance system. Make sure the PCB pads to which the antenna is connected are

properly designed to have a 50Ω impedance. The antenna supplier must specify the pad size,

the pitch from the pad to the ground reference plane, and the spacing from the pad edge to the

ground fill on the same layer as the pad. In addition, since the ground reference plane from the

antenna pad to the 50Ω trace of the device may be on a different layer than the ground

reference of the antenna pad, ensure that the pad design has an appropriate transition from

pad to pad 50Ω trace.

7.5. Power supply

The DC supply voltage should be decoupled as close as possible to the VCC pin with high

performance RF capacitors. Long power supply lines on the PCB should be avoided.

7.6. Thermal PAD vias

To increase the ground coupling, add at least 4 Vias directly from the DFN or QFN package paddle

to the solid ground.

7.7. GND

In four or more layers PCB designs it is recommended to have a dedicated ground plane. In that

case, make sure the ground plane is not broken by the routing of other signals. The power supply

can be routed on all layers except the ground floor. The power path should be a heavy copper filled

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