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PCF8545ATT датащи(PDF) 77 Page - NXP Semiconductors |
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PCF8545ATT датащи(HTML) 77 Page - NXP Semiconductors |
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77 / 103 page ![]() PCA8530 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 2 — 25 September 2014 77 of 103 NXP Semiconductors PCA8530 Automotive 102 x 4 Chip-On-Glass LCD segment driver 15. Application information 15.1 ITO layout recommendations for ESD/EMC robustness in COG applications The crucial factor for gaining an EMC and ESD robust application is the quality of the VSS1 line. • To get an EMC/ESD robust ITO/glass layout, the RITO(VSS1) has to be kept as low as possible. • In the most common applications VSS1 is connected to the pins T1, T2, A0, A1, OSC, SA0, SA1 and IFS (in the case of using the SPI interface) by using a very wide ITO connection • If possible, the ITO connection of VSS1 should be made wide, for example by fanning out the other connections • When the display is enabled, the charge and discharge caused by display activity affects the VSS1 line. This causes a dynamic current in the VSS1 line which means that dynamic voltage peaks in the VSS1 line may interfere with the low voltage part of the PCA8530. Therefore a low RITO(VSS1) is also important for an improved noise immunity of the PCA8530 especially at high VLCD values (VLCD >10V). • A low RITO(VSS1) also improves the communication stability with the microcontroller by reducing the effects of local ground (VSS1) bounce caused by high SDAACK currents. • It should be considered that VSS1 is internally connected to the IC substrate, therefore noise on the VSS1 line causes noise inside the IC. Figure 54 and Figure 55 are showing the recommended ITO connections for a COG layout according to the interface type use. |
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