MCF5373CAB180 datasheet(9/46 Pages) NXP

9 / 46 page

Pin Assignments and Reset States

MCF537x ColdFire® Microprocessor Data Sheet, Rev. 4

Freescale Semiconductor

USB Host & USB On-the-Go

USBOTG_M

—

I/O

USB

VDD

—

H14

USBOTG_P

—

I/O

USB

VDD

—

H13

USBHOST_M

—

I/O

USB

VDD

—

J13

USBHOST_P

—

I/O

USB

VDD

—

J12

FlexCAN (MCF53721 only)

CANRX and CANTX do not have dedicated bond pads. Please refer to the following pins for muxing:

I2C_SDA for CANRX and I2C_SCL for CANTX.

PWM

PWM7

PPWM7

—

I/O

EVDD

—

E13

PWM5

PPWM5

—

I/O

EVDD

—

E12

PWM3

PPWM3

DT3OUT

DT3IN

I/O

EVDD

—

E11

PWM1

PPWM1

DT2OUT

DT2IN

I/O

EVDD

—

F14

SSI

The SSI signals do not have dedicated bond pads. Please refer to the following pins for muxing: IRQ4 for SSI_MCLK,

IRQ1 for SSI_CLKIN, U1CTS for SSI_BCLK, U1RTS for SSI_FS, U1RXD for SSI_RXD, and U1TXD for SSI_TXD

I2C

I2C_SCL2

PFECI2C1

CANTX6

U2TXD

I/O

EVDD

—

I2C_SDA2

PFECI2C0

CANRX6

U2RXD

I/O

EVDD

—

DMA

DACK[1:0] and DREQ[1:0] do not have dedicated bond pads. Please refer to the following pins for muxing:

TS for DACK0, DT0IN for DREQ0, DT1IN for DACK1, and IRQ1 for DREQ1.

QSPI

QSPI_CS2

PQSPI5

U2RTS

—

EVDD

N12

QSPI_CS1

PQSPI4

PWM7

USBOTG_

PU_EN

EVDD

—

M12

QSPI_CS0

PQSPI3

PWM5

—

EVDD

—

M11

QSPI_CLK

PQSPI2

I2C_SCL2

—

EVDD

P12

QSPI_DIN

PQSPI1

U2CTS

—

EVDD

P11

QSPI_DOUT

PQSPI0

I2C_SDA2

—

EVDD

N11

Table 3. MCF5372/3 Signal Information and Muxing (continued)

Signal Name

GPIO

Alternate 1

Alternate 2

MCF5372

MCF5373

160 QFP

MCF5372L

MCF53721

MCF5373L

196 MAPBGA

MCF5373CAB180 датащи(PDF) 9 Page - NXP Semiconductors

MCF5373CAB180 датащи(HTML) 9 Page - NXP Semiconductors

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46

датащи скачать

ссылки URL