MCF5373CAB180 datasheet(43/46 Pages) NXP

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Revision History

MCF537x ColdFire® Microprocessor Data Sheet, Rev. 4

Freescale Semiconductor

Revision History

Table 28. MCF5373DS Document Revision History

Rev. No.

Substantive Changes

Date of Release

• Initial release

11/2005

0.1

• Swapped pin locations PLL_VSS (J11->H11) and DRAMSEL

(H11->J11) in Table 1. Figure 4 is correct.

12/2005

0.2

• Added not to Section 7, “Package Information.”

• Added “top view” and “bottom view” where appropriate in mechanical

drawings and pinout figures.

• Figure 6: Corrected “FB_CLK (75MHz)” label to “FB_CLK (80MHz)”

3/2006

0.3

• Changed 160QFP pinouts in Figure 5 and Table 2: Removed IRQ3

pin, shifted pins 89–99 up one pin to 90–100. Pin 89 is now VSS.

• Table 2: Rearranged GPIO signal names for FEC pins.

• Removed ULPI specifications as the device does not support ULPI.

4/2006

• Updated thermal characteristic values in Table 7.

• Updated DC electricals values in Table 7.

• Updated Section 3.3, “Supply Voltage Sequencing and Separation

Cautions” and subsections.

• Updated and added Oscillator/PLL characteristics in Table 8.

• Table 9: Swapped min/max for FB1; Removed FB8 & FB9.

• Updated SDRAM write timing diagram, Figure 9.

• Table 11: Added values for frequency of operation and DD1.

• Replaced figure & table Section 5.11, “SSI Timing Specifications,”

with slave & master mode versions.

• Removed second sentence from Section 5.13.2, “MII Transmit Signal

Timing,” regarding no minimum frequency requirement for TXCLK.

• Removed third and fourth paragraphs from Section 5.13.2, “MII

Transmit Signal Timing,” as this feature is not supported on this

device.

• Updated figure & table Section 5.17, “Debug AC Timing

Specifications.”

• Renamed & moved previous version’s Section 5.5 “Power

Consumption” to Section 6, “Current Consumption.” Added additional

real-world data to this section as well.

7/2007

• Added MCF53721 device information throughout: features list, family

configuration table, ordering information table, signals description

table, and relevant package diagram titles

• Remove Footnote 1 from Table 11.

• Changed document type from Advance Information to Technical Data.

8/2007

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