MCF5373CAB180 datasheet(2/46 Pages) NXP

2 / 46 page

MCF537x ColdFire® Microprocessor Data Sheet, Rev. 4

Freescale Semiconductor

Table of Contents

1MCF537x Family Comparison . . . . . . . . . . . . . . . . . . . . . . . . .3

Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

Hardware Design Considerations . . . . . . . . . . . . . . . . . . . . . . .5

3.1

PLL Power Filtering . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

3.2

USB Power Filtering . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

3.3

Supply Voltage Sequencing and Separation Cautions . .5

3.3.1

Power Up Sequence . . . . . . . . . . . . . . . . . . . . . .5

3.3.2

Power Down Sequence . . . . . . . . . . . . . . . . . . . .6

Pin Assignments and Reset States . . . . . . . . . . . . . . . . . . . . .6

4.1

Signal Multiplexing . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6

4.2

Pinout—196 MAPBGA . . . . . . . . . . . . . . . . . . . . . . . . .12

4.3

Pinout—160 QFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

5.1

Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

5.2

Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .15

5.3

ESD Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

5.4

DC Electrical Specifications . . . . . . . . . . . . . . . . . . . . .16

5.5

Oscillator and PLL Electrical Characteristics . . . . . . . .17

5.6

External Interface Timing Characteristics . . . . . . . . . . .18

5.6.1

FlexBus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19

5.7

SDRAM Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21

5.7.1

SDR SDRAM AC Timing Characteristics . . . . . 21

5.7.2

DDR SDRAM AC Timing Characteristics . . . . . 23

5.8

General Purpose I/O Timing . . . . . . . . . . . . . . . . . . . . 26

5.9

Reset and Configuration Override Timing . . . . . . . . . . 27

5.10 USB On-The-Go . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

5.11 SSI Timing Specifications . . . . . . . . . . . . . . . . . . . . . . 28

5.12 I2C Input/Output Timing Specifications . . . . . . . . . . . . 29

5.13 Fast Ethernet AC Timing Specifications . . . . . . . . . . . 31

5.13.1 MII Receive Signal Timing . . . . . . . . . . . . . . . . 31

5.13.2 MII Transmit Signal Timing . . . . . . . . . . . . . . . . 31

5.13.3 MII Async Inputs Signal Timing . . . . . . . . . . . . 32

5.13.4 MII Serial Management Channel Timing . . . . . 32

5.14 32-Bit Timer Module Timing Specifications . . . . . . . . . 33

5.15 QSPI Electrical Specifications . . . . . . . . . . . . . . . . . . . 33

5.16 JTAG and Boundary Scan Timing . . . . . . . . . . . . . . . . 34

5.17 Debug AC Timing Specifications . . . . . . . . . . . . . . . . . 36

Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

7.1

Package Dimensions—196 MAPBGA . . . . . . . . . . . . . 40

7.2

Package Dimensions—160 QFP . . . . . . . . . . . . . . . . . 41

Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

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