M69KB096AA datasheet(47/48 Pages) STMICROELECTRONICS

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M69KB096AA

REVISION HISTORY

Table 21. Document Revision History

Date

Rev.

Revision Details

13-Oct-2004

0.1

First Issue.

11-Feb-2005

0.2

ISB current for Standard Leakage option added in FEATURES SUMMARY.

ISB current for Standard Leakage option added in Table 13., DC Characteristics and test

conditions updated. ITCR current for Standard Leakage option added in Table

14., Temperature Compensated Refresh Specifications and Conditions. IPAR current for

Standard Leakage option added in Table 15., Partial Array Refresh Specifications and

Conditions.

Standard Leakage option added in Table 20., Ordering Information Scheme.

29-Apr-2005

1.0

Root Part Number changed to M69KB096AA.

104MHz maximum clock frequency and Low Leakage option removed.

Temperature range updated to –30°C to +85°C.

Clock Input (K). definition updated. Figure 3., Block Diagram modified.

Bus Modes Tables 2, 3 and Synchronous Burst Mode paragraph updated.

Output Impedance Bit (BCR5) renamed Driver Strength and definition updated.

R1 and R2 updated in Table 13., DC Characteristics and Refresh Specifications and

Conditions tables merged into Table 14..

Figures 15, 16, and 17 describing Asynchronous Read AC waveforms updated.

Figures 18, 19, 20, 21 and 22 describing Synchronous Read AC waveforms updated.

Figures 23, 24, and 25, describing Asynchronous Write AC waveforms updated. tAVWL and

tAVBL added in Table 17., Asynchronous Write AC Characteristics.

Figures 28 and 29 added.

Figures 30, 31, and 32, describing Synchronous Write AC waveforms updated. Figure

32., Synchronous Burst Write Followed by Read AC Waveforms (4 Words) added. tRHKH

and tKHRL added in Table 18., Synchronous Burst Write AC Characteristics

Table 21., Bond Pad Location and Identification modified to express the pad coordinates

from the center of the die.

16-June-2005

2.0

, FEATURES SUMMARY, OPERATING MODES and Figure 5., Synchronous Burst Write

Mode (4-word burst) modified.

18-Aug-2005

3.0

Updated Note 2 in Table 13., page 23, added notes to Table 14., page 24 and Table

17., page 40. Deleted Note 5 from Table 15., page 27.

12-Dec-2005

Clock rate added in datasheet title.

Test conditions for ICC1, ICC1P, ICC2, ICC3R, ICC3W and ISB updated in Table 13., DC

Characteristics.

19-Jan-2006

Section Wafer and die specifications removed.

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