ADA4097-1BUJZ-R5 datasheet(8/27 Pages) AD

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ADA4097-1

Data Sheet

Rev. 0 | Page 8 of 27

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Supply Voltage1

Transient

60 V

Continuous

50 V

Power Dissipation (PD)

See Figure 3

Differential Input Voltage

±80 V

±IN Pin Voltage

Continuous

−10 V to +80 V

Survival

−15 V to +80 V

±IN Pin Current

10 mA

SHDN Pin Voltage

−0.3 V to +60 V

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−55°C to +150°C

Lead Temperature (Soldering, 10 sec)

300°C

175°C

1 Maximum supply voltage is limited by the TDDB of the on-chip capacitor

oxides. The amplifier tolerates temporary transient overshoot up to the

specified transient maximum rating. The continuous operating supply

voltage must be limited to no more than 50 V.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the device. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

TJ exceeding 125°C promotes accelerated aging. The ADA4097-1

demonstrates ±25 V supply operation beyond 1000 hours at

TA = 150°C.

MAXIMUM POWER DISSIPATION

The maximum safe PD on the device is limited by the associated

rise in either TC or TJ on the die. At approximately TC = 150°C,

which is the glass transition temperature, the properties of the

plastic changes. Exceeding this temperature limit, even temporarily,

may change the stresses that the package exerts on the die, which

permanently shifts the parametric performance of the ADA4097-1.

Exceeding TJ = 175°C for an extended period may result in changes

in the silicon devices and may potentially cause failure of the device.

The PD on the package is the sum of the quiescent power dissipation

and the power dissipated in the package due to the output load

drive. The quiescent power is expressed as VSY × ISY, where ISY is

the quiescent current.

The PD due to the load drive depends on the application. The PD

due to load drive is calculated by multiplying the load current

by the associated voltage drop across the device. RMS voltages

and currents must be used in these calculations.

Airflow increases heat dissipation, effectively reducing θJA.

Additional metal that is directly in contact with the package leads

from metal traces through vias, ground, and power planes

reduces θJA.

Figure 3 shows the maximum PD vs. TA for the single and dual

6-lead TSOT packages on a JEDEC standard, 4-layer board, with

−VS connected to a pad that is thermally connected to a printed

circuit board (PCB) plane. θJA values are approximations.

1.4

0.4

0.8

1.2

0.2

0.6

1.0

–60

150

–30

0120

AMBIENT TEMPERATURE (°C)

Figure 3. Maximum Power Dissipation vs. Ambient Temperature

THERMAL RESISTANCE

Thermal performance is directly linked to PCB design and

operating environment. Careful attention to PCB thermal

design is required.

θJA is the junction to ambient thermal resistance.

Table 4. Thermal Resistance

Package Type

θJA

Unit

UJ-6

192

C/W

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of

ESD-sensitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

Field induced charged device model (FICDM) per

ANSI/ESDA/JEDEC JS-002.

ESD Ratings for ADA4097-1

Table 5. ADA4097-1, 6-Lead TSOT

ESD Model

Withstand Threshold

Class

HBM

±2 kV

FICDM

±1.25 kV

ESD CAUTION

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