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TMS29F010-12CSFML датащи(PDF) 17 Page - Texas Instruments |
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TMS29F010-12CSFML датащи(HTML) 17 Page - Texas Instruments |
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17 / 36 page ![]() TMS29F010 131072 BY 8-BIT FLASH MEMORY SMJS840A – NOVEMBER 1997 – REVISED JUNE 1998 17 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443 timing requirements controlled by E (see Figure 5) ALTERNATE ’29F010-70 ’29F010-90 UNIT SYMBOL MIN TYP MAX MIN TYP MAX UNIT tAVAV Cycle time, write tc(W) 70 90 ns tEHEH1 Cycle time, programming operation 18 18 µs tEHEH2 Cycle time, sector-erase operation (see Note 11) 1 15 1 15 s tEHEH3 Cycle time, chip-erase operation (see Note 12) 2 60 2 60 s tELAX Hold time, address th(A) 45 45 ns tEHDX Hold time, data th(D) 0 0 ns tEHWH Hold time, W th(W) 0 0 ns tELEH Pulse duration, E low tw(EL) 35 45 ns tEHEL Pulse duration, E high tw(EH) 20 20 ns tGHEL Recovery time, read-before-write trec(R) 0 0 ns tAVEL Setup time, address tsu(A) 0 0 ns tDVEH Setup time, data tsu(D) 30 45 ns tWLEL Setup time, W tsu(W) 0 0 ns NOTES: 11. Timing diagram of E-controlled sector-erase operation not enclosed. 12. Timing diagram of E-controlled chip-erase operation not enclosed. ALTERNATE ’29F010-10 ’29F010-12 UNIT SYMBOL MIN TYP MAX MIN TYP MAX UNIT tAVAV Cycle time, write tc(W) 100 120 ns tEHEH1 Cycle time, programming operation 18 18 µs tEHEH2 Cycle time, sector-erase operation (see Note 11) 1 15 1 15 s tEHEH3 Cycle time, chip-erase operation (see Note 12) 2 60 2 60 s tELAX Hold time, address th(A) 45 50 ns tEHDX Hold time, data th(D) 0 0 ns tEHWH Hold time, W th(W) 0 0 ns tELEH Pulse duration, E low tw(EL) 45 50 ns tEHEL Pulse duration, E high tw(EH) 20 20 ns tGHEL Recovery time, read-before-write trec(R) 0 0 ns tAVEL Setup time, address tsu(A) 0 0 ns tDVEH Setup time, data tsu(D) 45 50 ns tWLEL Setup time, W tsu(W) 0 0 ns NOTES: 11. Timing diagram of E-controlled sector-erase operation not enclosed. 12. Timing diagram of E-controlled chip-erase operation not enclosed. |
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