ISL97635A datasheet(5/29 Pages) RENESAS

5 / 29 page

ISL97635A

FN6564 Rev.3.00

Page 5 of 29

Sep 26, 2017

Absolute Maximum Ratings (T

A = +25°C)

Thermal Information

VIN, FAULT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 24V

VDC, COMP, RSET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6.5V

SMBCLK, SMBDAT, FPWM, PWMO, EN/PWM . . . . . . . . . . . . . -0.3V to 6.5V

OVP, IIN0 - IIN5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 28V

LX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 36V

PGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +0.3V

Above voltage ratings are all with respect to GND pin

Operating Conditions

Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C

Thermal Resistance (Typical, Notes 1, 2)

JA (°C/W) JC (°C/W)

24 Ld QFN . . . . . . . . . . . . . . . . . . . . . . . . . . .

Thermal Characterization (Typical, Note 3)PSIJT (°C/W)

24 Ld QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

~0.7

Maximum Continuous Junction Temperature . . . . . . . . . . . . . . . . .+125°C

Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C

Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493

IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests

are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA

CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and

result in failures not covered by warranty.

NOTES:

JA is measured in free air with the component mounted on a high-effective thermal conductivity test board with “direct attach” features. Refer to

TB379.

2. For

JC, the “case temp” location is the center of the exposed metal pad on the package underside assumed under ideal case temperature.

3. PSIJT is the junction-to-top thermal resistance. If the package top temperature can be measured, with this rating then the die junction temperature

can be estimated more accurately than the

JC and JC thermal resistance ratings.

Electrical Specifications All specifications below are tested at T

A = -40°C to +85°C; VIN = 12V, EN = 5V, RSET = 36.6kΩ, unless

otherwise noted. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by

characterization and are not production tested.

PARAMETER

SYMBOL

CONDITION

MIN

TYP

MAX UNIT

GENERAL

Backlight Supply Voltage

VIN

 9 LEDs per channel (3.5V/30mA type)

VIN Shutdown Current

IVIN_STBY

µA

Output Voltage

VOUT

34.5

Undervoltage Lockout Threshold

VUVLO

2.45

2.8

Undervoltage Lockout Hysteresis

VUVLO_HYS

300

REGULATOR

LDO Output Voltage

VDC

VIN >6V

5.0

5.5

Standby Current

IVDC_STBY

EN/PWM = 0V

µA

Active Current

IVDC

EN/PWM = 5V

VDC LDO Dropout Voltage

VLDO

VIN > 5.5V, 30mA

200

Soft-Start

Minimum Enable Signal

ENmin

µs

BOOST

Boost FET Current Limit

SWILimit

TA = +25°C

2.3

3.2

TA = -40°C to +85°C

2.2

Internal Boost Switch ON-Resistance

rDS(ON)

130

260

mΩ

Peak Efficiency

Eff_peak

VIN = 18V, 54 LEDs, 20mA each, L = 8.2µH

with DCR 106mΩ

TA = +25°C

VIN = 12V, 54 LEDs, 20mA each, L = 8.2µH

with DCR 106mΩ

TA = +25°C

VIN = 6V, 54 LEDs, 20mA each, L = 8.2µH

with DCR 106mΩ

TA = +25°C

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