MP2624GL datasheet(6/45 Pages) MPS

6 / 45 page

MP2624 – 4.5A SW CHARGER W/ I2C CONTROL, NVDC POWER PATH, USB OTG

MP2624 Rev.1.05

www.MonolithicPower.com

4/9/2018

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ABSOLUTE MAXIMUM RATINGS (1)

IN, PMID, STAT to GND ...............-0.3V to +20V

SW to GND ............-0.3V (-2V for 20ns) to +20V

BST to GND…………........................ SW to +6V

BATT, SYS to GND………………. ..-0.3V to +6V

All other pins to GND ......................-0.3V to +6V

STAT, INT sink current ............................. 10mA

Continuous power dissipation

(TA = +25C)

(2)

................................................................... 2.6W

Junction temperature

............................150

C

Lead temperature (solder) ........................260

C

Storage temperature…. .......... -65°C to +150

C

Recommended Operating Conditions

(3)

VIN to GND .............................. .....3.9V to 7.0V

(4)

IIN...........................................................Up to 3A

ISYS .....................................................Up to 4.5A

ICHG.....................................................Up to 4.5A

VBATT...............................................Up to 4.425V

IDCHG .................................(Continuous) up to 6A

IDCHG ..........................................(Pulse) up to 9A

Operating junction temp. (TJ) ... -40C to +125C

Thermal Resistance (5)

θJA

θJC

QFN-22 (3mm x 4mm)............ 48 ...... 11....°C/W

NOTES:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will produce an excessive die temperature,

causing the regulator to go into thermal shutdown. Internal

thermal shutdown circuitry protects the device from

permanent damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) The inherent switching noise voltage should not exceed the

absolute maximum rating on either BST or SW. A tight layout

minimizes switching loss.

5) Measured on JESD51-7, 4-layer PCB.

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