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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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TLE9255WLC датащи(PDF) 71 Page - Infineon Technologies AG |
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TLE9255WLC датащи(HTML) 71 Page - Infineon Technologies AG |
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71 / 100 page  Data Sheet 71 Rev. 1.02 2018-02-02 TLE9255W General Product Characteristics 9.3 Thermal Resistance Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information please visit www.jedec.org. Table 7 Thermal resistance1) 1) Not subject to production test, specified by design Parameter Symbol Values Unit Note or Test Condition Number Min. Typ. Max. Thermal Resistance Junction to ambient RthJA_DSO14 – 130 – K/W 2) 2) Specified RthJA value is according to Jedec JESD51-2,-7 at natural convection on FR4 2s2p board; The Product (Chip + Package) was simulated on a 76.2 × 114.3 × 1.5 mm board with 2 inner copper layers (2 × 70 mm Cu, 2 × 35 mm Cu). P_9.3.1 Thermal Shutdown Junction Temperature Thermal shut-down temperature TJSD 170 180 190 °C – P_9.3.3 Thermal shutdown hysteresis ∆T 510 20 K – P_9.3.4 |
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