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LTC2435-1IGN датащи(PDF) 29 Page - Linear Technology |
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LTC2435-1IGN датащи(HTML) 29 Page - Linear Technology |
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29 / 40 page ![]() LTC2435/LTC2435-1 29 24351fa APPLICATIO S I FOR ATIO Figure 25. INL vs Differential Input Voltage (VIN = IN+ – IN–) and Reference Source Resistance (RSOURCE at REF + and REF– for Large CREF Values (CREF ≥ 1µF) In addition to this gain error, the converter INL perfor- mance is degraded by the reference source impedance. When FO = LOW (internal oscillator and 60Hz notch), every 100Ω of source resistance driving REF+ or REF– translates into about 0.11ppm additional INL error. For the LTC2435, when FO = HIGH (internal oscillator and 50Hz notch), every 100Ω of source resistance driving REF+ or REF– translates into about 0.092ppm additional INL error; and for the LTC2435-1 operating with simultaneous 50Hz/60Hz re- jection, every 100Ω of source resistance leads to an additional 0.10ppm of additional INL error. When FO is driven by an external oscillator with a frequency fEOSC, every 100Ω of source resistance driving REF+ or REF– translates into about 0.73 • 10–6 • fEOSCppm additional INL error. Figure 25 shows the typical INL error due to the source resistance driving the REF+ or REF– pins when large CREF values are used. The effect of the source resistance on the two reference pins is additive with respect to this INL error. In general, matching of source impedance for the REF+ and REF– pins does not help the gain or the INL error. The user is thus advised to minimize the combined source impedance driving the REF+ and REF– pins rather than to try to match it. The magnitude of the dynamic reference current depends upon the size of the very stable internal sampling capaci- tors and upon the accuracy of the converter sampling clock. The accuracy of the internal clock over the entire temperature and power supply range is typical better than 0.5%. Such a specification can also be easily achieved by an external clock. When relatively stable resistors (50ppm/°C) are used for the external source impedance seen by REF+ and REF–, the expected drift of the dynamic current gain error will be insignificant (about 1% of its value over the entire temperature and voltage range). Even for the most stringent applications a one-time calibration operation may be sufficient. In addition to the reference sampling charge, the reference pins ESD protection diodes have a temperature dependent leakage current. This leakage current, nominally 1nA (±10nA max), results in a small gain error. A 100Ω source resistance will create a 0.05µV typical and 0.5µV maxi- mum full-scale error. Figure 24. –FS Error vs RSOURCE at REF + and REF– (Large CREF) Figure 23. +FS Error vs RSOURCE at REF+ and REF– (Large CREF) RSOURCE (Ω) 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 2435 F24 0 400 800 1200 1600 2000 VCC = 5V VREF+ = 5V VREF– = GND VIN+ = 1.25V VIN– = 3.75V FO = GND TA = 25°C CIN = 1µF, 10µF CIN = 0.01µF CIN = 0.1µF RSOURCE (Ω) 100 90 80 70 60 50 40 30 20 10 0 2435 F23 0 400 800 1200 1600 2000 VCC = 5V VREF+ = 5V VREF– = GND VIN+ = 3.75V VIN– = 1.25V FO = GND TA = 25°C CIN = 1µF, 10µF CIN = 0.01µF CIN = 0.1µF VINDIF/VREFDIF (V) 15 12 9 6 3 0 –3 –6 –9 –12 –15 2435 F25 0 0.1 –0.1 0.2 –0.2 0.3 –0.3 0.4 –0.4 0.5 –0.5 RSOURCE = 10k RSOURCE = 5k RSOURCE = 1k VINCM = 0.5 • (IN + + IN–) = 2.5V VCC = 5V REF+ = 5V REF– = GND FO = GND CREF = 10µF TA = 25°C |
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