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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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STM8L101x2 датащи(PDF) 64 Page - STMicroelectronics |
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STM8L101x2 датащи(HTML) 64 Page - STMicroelectronics |
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64 / 88 page  Package information STM8L101x1 STM8L101x2 STM8L101x3 64/88 DocID15275 Rev 16 10 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 10.1 UFQFPN32 package information Figure 37. UFQFPN32 - 32-lead ultra thin fine pitch quad flat no-lead package outline (5 x 5) 1. Drawing is not to scale. 2. All leads/pads should be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this back-side pad to PCB ground. |
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