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ISO8200BQ датащи(PDF) 24 Page - STMicroelectronics

номер детали ISO8200BQ
подробное описание детали  Galvanic isolated octal high-side smart power solid state-relay
PDF  37 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

ISO8200BQ датащи(HTML) 24 Page - STMicroelectronics

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ISO8200BQ
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DocID027303 Rev 4
7.2
Thermal protection
The device is protected against overheating in case of overload conditions. During the
driving period, if the output is overloaded, the device suffers two different thermal stresses,
the former related to the junction, and the latter related to the case.
The two faults have different trigger thresholds: the junction protection threshold is higher
than the case protection one; generally the first protection, that is active in thermal stress
conditions, is the junction thermal shutdown. The output is turned off when the temperature
is higher than the related threshold and turned back on when it goes below the reset
threshold. This behavior continues until the fault on the output is present.
If the thermal protection is active and the temperature of the package increases over the
fixed case protection threshold, the case protection is activated and the output is switched
off and back on when the junction temperature of each channel in fault and case
temperature is below the respective reset thresholds.
Figure 17: "Thermal protection flowchart" shows the thermal protection behavior, while
Figure 18: "Thermal protection" reports typical temperature trends and output vs. input
state.
Figure 17: Thermal protection flowchart



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