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ISO8200BQ датащи(PDF) 14 Page - STMicroelectronics

номер детали ISO8200BQ
подробное описание детали  Galvanic isolated octal high-side smart power solid state-relay
PDF  37 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
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Electrical characteristics
ISO8200BQ
14/37
DocID027303 Rev 4
Table 9: Parallel interface timings (Vdd = 5 V; VCC= 24 V; -40 °C < TJ < 125 °C)
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
tdis(SYNC)
SYNC
disable time
Sync. control mode
10
µs
tdis(DCM)
SYNC , LOAD
disable time
Direct control mode
80
ns
tw(SYNC)
SYNC
negative pulse
width
Sync. control mode
20
195
µs
tsu(LOAD)
LOAD
setup time
Sync. control mode
80
ns
th(LOAD)
LOAD
hold time
Sync. control mode
400
ns
tw(LOAD)
LOAD
pulse width
Sync. control mode
240
ns
tsu(IN)
Input setup time
80
ns
th(IN)
Input hold time
10
ns
tw(IN)
Input pulse width
Sync. control mode
160
ns
Direct control mode
20
µs
tINLD
IN to LOAD
time
Direct control mode
From IN variation to LOAD
falling edge
80
ns
tLDIN
LOAD
to IN time
Direct control mode
From LOAD falling edge to IN
variation
400
ns
tw(OUT_EN)
OUT_EN pulse width
150
ns
tp(OUT_EN)
OUT_EN propagation
delay
22
40
µs
tjitter(SCM)
Jitter on single channel
Sync. mode
6
µs
tjitter(DCM)
Direct mode
20
frefresh
Refresh delay
15
kHz
Table 10: Insulation and safety-related specifications
Symbol
Parameter
Test conditions
Value
Unit
CLR
Clearance (minimum
external air gap)
Measured from input terminals to output
terminals, the shortest distance through air
3.3
mm
CPG
Creepage (minimum
external tracking)
Measured from input terminals to output
terminals, the shortest distance path analog
body
3.3
mm
CTI
Comparative tracking
index (tracking
resistance)
DIN IEC 112/VDE 0303 part 1
≥ 600
V
Isolation group
Material group (DIN VDE 0110, 1/89), table 1
I
-



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