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L2G2IS датащи(PDF) 24 Page - STMicroelectronics |
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L2G2IS датащи(HTML) 24 Page - STMicroelectronics |
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24 / 26 page ![]() Package information L2G2IS 24/26 DocID027248 Rev 2 8 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 8.1 Soldering information The LGA package is compliant with the ECOPACK®, RoHS and “Green” standard. It is qualified for soldering heat resistance according to JEDEC J-STD-020. Leave “Pin 1 Indicator” unconnected during soldering. Land pattern and soldering recommendations are available at www.st.com/mems. 8.2 LGA-16 package Figure 10. LGA-16 package outline and dimensions Table 34. LGA-16 package outer dimensions Item Dimension [mm] Tolerance [mm] Length [L] 2.30 ±0.1 Width [W] 2.30 ±0.1 Height [H] 0.70 MAX |
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