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MB91F467DA датащи(PDF) 133 Page - Cypress Semiconductor |
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MB91F467DA датащи(HTML) 133 Page - Cypress Semiconductor |
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133 / 137 page ![]() Document Number: 002-04613 Rev. *A Page 133 of 137 MB91460D Series 17. Package Dimension 208-pin plastic QFP Lead pitch 0.50 mm Pa ckage width × package length 28.0 × 28.0 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 3.95 mm MAX We ight 5.71g Remar k Low heat resistance type 208-pin plastic QFP (FPT -208P-M04) (FPT-208P-M04) C 2003-2008 FUJITSU MICROELECTRONICS LIMITED F208020S-c-3-5 .148 –.012 +.008 –0.30 +0.20 3.75 Details of "A" par t 0.50±0.20 (.020±.008) 0.60±0.15 (.024±.006) 0.25(.010) (Stand off) 0.40 +0.10 –0.15 +.004 –.006 .016 0˚~8˚ 1 LEAD No . 52 53 104 105 156 157 208 "A" 0.08(.003) 0.50(.020) 0.22±0.05 (.009±.002) 0.08(.003) M 28.00±0.10(1.102±.004)SQ 30.60±0.20(1.205±.008)SQ .007 –.003 +.001 –0.08 +0.03 0.17 INDEX (Mounting height) * Dimensions in mm (inches). Note: The values in parentheses are reference values. Note 1) * : These dimensions do not include resin protrusion. Note 2) Pins width and pins thickness include plating thickness. Note 3) Pins width do not include tie bar cutting remainder. |
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