LP8754

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SNVS861A – FEBRUARY 2014 – REVISED AUGUST 2014

General Electrical Characteristics

(1)(2) (continued)

Limits apply over the full ambient temperature range -40°C

SYMBOL

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

LOGIC AND CONTROL INPUTS SCLSR, SDASR, NSLP, NRST

Input low level

Input high level

V

Hysteresis of Schmitt trigger

inputs (SCLSR, SDASR)

Capacitance of SCLSR and

4

pF

SDASR pins

Input resistance

NRST pulldown resistor to GND

1200

k

Ω

Input low level NRST

0.54

V

Input high level NRST

1.3

LOGIC AND CONTROL OUTPUTS

0.4

Output low level

V

mA,

0.36

External pull-up resistor for

To I/O Supply

10

k

Ω

INT

ALL LOGIC AND CONTROL INPUTS

All Logic Inputs over pin voltage range.

Note that NRST pin does have an 1.2-M

Ω

Input current

internal pulldown resistor and current

−1

1

µA

through this resistor is not included into

6.6 6-Phase Buck Electrical Characteristics

Limits apply over the full ambient temperature range -40°C

SYMBOL

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Differential feedback voltage

max

(1)

(2)

2.5%,

- 25 mV)

25 mV)

max

2.5%,

V

- 25 mV)

25 mV)

max

to 1.67 V,

3%,

30 mV)

30 mV)

(1)

Due to the nature of the converter operating in PFM mode/Low-Power Mode, the Feedback Voltage accuracy specification is for the

lower point of the ripple. Thus the converter will position the average output voltage typically slightly above the nominal PWM-mode

output voltage.

(2)

The power switches in the LP8754 are designed to operate continuously with currents up to the switch current limit thresholds. However,

when continuously operating at high current levels there will be significant heat generated within the IC and thus sustained total DC

current which the device can support is typically limited by thermal constraints. Thermal issues will become extremely important when

designing PCB and the thermal environment of the LP8754. PCB with high thermal efficiency is required to ensure the junction

temperature is kept below 125°C. Completing thermal analyses in early stages of the product design process is highly recommended to

predict thermal performance at board level. Under high current load conditions the serial bus master device must monitor the

temperature of the converter using the Thermal warning feature, see Protection Features Characteristics. If the 2nd thermal warning is

triggered at 120°C, the application must quickly decrease the load current to keep the converter within its recommended operating

temperature.

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