LP8754

SNVS861A – FEBRUARY 2014 – REVISED AUGUST 2014

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6.4 Thermal Information

LP8754

YFQ

UNIT

49 PINS

Junction-to-ambient thermal resistance

49.2

Junction-to-case (top) thermal resistance

0.2

Junction-to-board thermal resistance

6.6

°C/W

Junction-to-top characterization parameter

2.9

Junction-to-board characterization parameter

6.5

Junction-to-case (bottom) thermal resistance

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 General Electrical Characteristics

(1) (2)

Limits apply over the full ambient temperature range -40°C

SYMBOL

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

CURRENTS

Shutdown supply current.

Total current into power

0.1

2

connections VDDA5V and

VINBXX

µA

Standby mode supply current.

Total current into power

50

connections VDDA5V and

VINBXX

Low-power PFM Mode, no load, one core

130

µA

Active mode current

active

consumption. Total current

PFM Mode, no load, one core active

400

µA

into power connections

Forced PWM Mode, no load, one core

VDDA5V and VINBXX

14.5

mA

active

LOGIC AND CONTROL INPUTS SCLSYS, SDASYS, ADDR

0.3 x

Input low level

Input high level

V

Hysteresis of Schmitt trigger

inputs (SCLSYS, SDASYS)

Capacitance of pins

4

pF

(1)

All voltage values are with respect to network ground pin.

(2)

Minimum (Min) and Maximum (Max) limits are specified by design, test, or statistical analysis. Typical (Typ.) numbers are not ensured,

but do represent the most likely norm.

(3)

Maximum capacitance of SCLSYS or SDASYS line is 8 pF, if ADDR pin is connected to line for serial bus address selection.

6

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