ISO5451DW datasheet(19/38 Pages) TI

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Ambient Temperature (qC)

100

150

200

100

150

200

250

300

350

400

VCC1 = 3.6 V

VCC1 = 5.5 V

VCC2 = 15 V

VCC2 = 30 V

Ambient Temperature (qC)

100

150

200

400

600

800

1000

1200

1400

Power

ISO5451

www.ti.com

SLLSEO1B – JUNE 2015 – REVISED DECEMBER 2015

9.3.6.5 Safety Limiting Values

Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry.

A failure of the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate

sufficient power to overheat the die and damage the isolation barrier, potentially leading to secondary system

failures.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

θJA = 99.6°C/W, VI = 3.6 V, TJ = 150°C,

349

TA = 25°C

θJA = 99.6°C/W, VI = 5.5 V, TJ = 150°C,

228

TA = 25°C

Safety input, output or supply current

θJA = 99.6°C/W, VI = 15 V, TJ = 150°C,

TA = 25°C

θJA = 99.6°C/W, VI = 30 V, TJ = 150°C,

TA = 25°C

Safety input, output, or total power

θJA = 99.6°C/W, TJ = 150°C, TA = 25°C

1255(1)

Maximum ambient safety

150

°C

temperature

(1)

Input, output, or the sum of input and output power should not exceed this value

The safety-limiting constraint is the absolute-maximum junction temperature specified in the Absolute Maximum

Ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the

application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the

Thermal Information table is that of a device installed in the High-K Test Board for Leaded Surface-Mount

Packages. The power is the recommended maximum input voltage times the current. The junction temperature is

then the ambient temperature plus the power times the junction-to-air thermal resistance.

Figure 39. Thermal Derating Curve for Safety Limiting

Figure 40. Thermal Derating Curve for Safety Limiting

Current per VDE

Power per VDE

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