UCD3138ARMHT datasheet(15/83 Pages) TI

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UCD3138A

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SLUSC66B – MARCH 2015 – REVISED MAY 2015

Electrical Characteristics (continued)

V33A = V33D = V33DIO = 3 V to 3.6 V; 1

μF from BP18 to DGND, TJ = –40°C to 125°C (unless otherwise noted)

PARAMETER

TEST CONDITION

MIN

TYP

MAX

UNIT

POWER ON RESET AND BROWN OUT (V33D pin, See Figure 5-4)

VGH

Voltage good high

2.7

VGL

Voltage good low

2.5

Vres

Voltage at which I

RESET signal is valid

0.8

Time delay after power is good or

TPOR

RESET relinquished

Internal signal warning of brownout

Brownout

2.9

conditions

TEMPERATURE SENSOR(7)

VTEMP

Voltage range of sensor

1.46

2.44

Voltage resolution

V/°C

5.9

mV/ºC

Temperature resolution

°C per bit

0.1034

ºC/LSB

Accuracy(7)(8)

–40°C to 125°C

–10

±5

ºC

Temperature range

–40°C to 125°C

–40

125

ºC

ITEMP

Current draw of sensor when active

μA

TON

Turn on time / settling time of sensor

100

μs

VAMB

Ambient temperature

Trimmed 25°C reading

1.85

ANALOG COMPARATOR

DAC

Reference DAC Range

2.5

Reference Voltage

2.478

2.5

2.513

Bits

bits

INL(7)

–0.42

0.21

LSB

DNL(7)

0.06

0.12

LSB

Offset

–5.5

19.5

Time to disable DPWM output based on 0

V to 2.5 V step input on the analog

150

comparator.(1)

Reference DAC buffered output load(9)

0.5

Buffer offset (–0.5 mA)

0.3 V < DAC < 2.17 V

Buffer offset (1.0 mA)

0.3 V < DAC < 2.17 V

–10

(7)

Characterized by design and not production tested.

(8)

Ambient temperature offset value should be used from the TEMPSENCTRL register to meet accuracy.

(9)

Available from reference DACs for comparators D, E, F, and G.

5.5

Thermal Characteristics

UCD3138A

THERMAL METRIC(1)

UNIT

64 PIN QFN

40 PIN QFN

(RGC)

(RMH)

RθJA

Junction-to-ambient thermal resistance

25.1

31.0

RθJC(top)

Junction-to-case (top) thermal resistance

10.5

16.5

RθJB

Junction-to-board thermal resistance

4.6

6.3

°C/W

ψJT

Junction-to-top characterization parameter

0.2

ψJB

Junction-to-board characterization parameter

4.6

6.3

RθJC(bot)

Junction-to-case (bottom) thermal resistance

1.2

1.1

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953

Specifications

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