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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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UPD62AMC датащи(PDF) 55 Page - NEC |
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UPD62AMC датащи(HTML) 55 Page - NEC |
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55 / 62 page  55 µPD62A Data Sheet U14474EJ1V0DS00 15. RECOMMENDED SOLDERING CONDITIONS The µPD62A should be soldered and mounted under the following recommended conditions. For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting Technology Manual (C10535E). For soldering methods and conditions other than those recommended below, contact your NEC sales representa- tives. Table 15-1. Surface Mounting Type Soldering Conditions µPD62AMC-×××-5A4: 20-pin plastic SSOP (300 mils) Soldering Method Soldering Conditions Recommended Condition Symbol Infrared reflow Package peak temperature: 235 °C; Time: 30 seconds max. (at 210°C or higher); IR35-00-3 Count: three times or less VPS Package peak temperature: 215 °C; Time: 40 seconds. max. (at 200°C or higher); VP15-00-3 Count: Three times or less Wave soldering Solder bath temperature: 260 °C max.; Time: 10 seconds max.; Count: once; WS60-00-1 Preheating temperature: 120 °C max. (package surface temperature) Partial heating Pin temperature: 300 °C or less; Time: 3 seconds max. (per pin row) — Caution Do not use different soldering methods together (except for partial heating). |
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