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AN4043 датащи(PDF) 35 Page - STMicroelectronics

номер детали AN4043
подробное описание детали  In recent years the variable speed motor control market has required high performance
PDF  60 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

AN4043 датащи(HTML) 35 Page - STMicroelectronics

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AN4043
Package
Doc ID 022726 Rev 2
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3
Package
The NDIP is a dual-in-line transfer mold package available in 26-lead version (NDIP-26L)
able to meet demanding cost and size requirements of consumer appliance inverters. It
consists of a copper lead frame with power stage and control stage soldered on it and
housed using the transfer molding process. The excellent thermal properties of the copper
allows good heat spread and heat transfer, furthermore, the thickness and the layout of the
lead frames has been optimized in order to further reduce the thermal resistance.
The package pinout has been designed in order to maximize the distance between the high
voltage and low voltage pins, by placing the relevant pins on the opposite side of the
package. This is mainly useful to keep a safe distance between high voltage and low voltage
pins and for an easy PCB layout.
Finally, thanks to the transfer molding technology and design optimization, the SLLIMM-
nano offers a high power density level in a very compact package while providing good
thermal propriety, electrical isolation and overall reliable performance.
3.1
Package structure
Figure 23 contains the images and an internal structure illustration of the NDIP-26L
package.
Figure 23.
Images and internal view of NDIP-26L package
Top view
Bottom view
Internal view
x = 29.5 mm
y1 = 12.5 mm (body only)
y2 = 22 mm (including leads)
z1 = 3.1 mm (body only)
z2 = 7 mm (including leads)
Main dimensions
x
y
z
SLL
IMM
-nan
o
SLLIMM-nano
NDIP-26L
IGBT
FWD
HVIC



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