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IO20PDB0V0 датащи(PDF) 19 Page - Microsemi Corporation

номер детали IO20PDB0V0
подробное описание детали  SmartFusion Customizable System-on-Chip (cSoC)
PDF  197 Pages
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производитель  MICROSEMI [Microsemi Corporation]
домашняя страница  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

IO20PDB0V0 датащи(HTML) 19 Page - Microsemi Corporation

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SmartFusion Customizable System-on-Chip (cSoC)
Re vi s i on 12
2 - 7
Thermal Characteristics
Introduction
The temperature variable in the SoC Products Group Designer software refers to the junction
temperature, not the ambient, case, or board temperatures. This is an important distinction because
dynamic and static power consumption will cause the chip's junction temperature to be higher than the
ambient, case, or board temperatures. EQ 1 through EQ 3 give the relationship between thermal
resistance, temperature gradient, and power.
EQ 1
EQ 2
EQ 3
where
θJA = Junction-to-air thermal resistance
θJB = Junction-to-board thermal resistance
θJC = Junction-to-case thermal resistance
TJ
= Junction temperature
TA = Ambient temperature
TB = Board temperature (measured 1.0 mm away from the
package edge)
TC = Case temperature
P
= Total power dissipated by the device
Table 2-6 • Package Thermal Resistance
Product
θJA
θJC
θJB
Units
Still Air
1.0 m/s
2.5 m/s
A2F200M3F-FG256
33.7
30.0
28.3
9.3
24.8
°C/W
A2F200M3F-FG484
21.8
18.2
16.7
7.7
16.8
°C/W
A2F200M3F-CS288
26.6
20.2
18.1
7.3
9.4
°C/W
A2F200M3F-PQG208I
38.5
34.6
33.1
0.7
31.6
°C/W
θJA
TJ θA
–
P
------------------
=
θJB
TJ TB
–
P
-------------------
=
θJC
TJ TC
–
P
-------------------
=



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