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IO20PDB0V0 датащи(PDF) 36 Page - Microsemi Corporation

номер детали IO20PDB0V0
подробное описание детали  SmartFusion Customizable System-on-Chip (cSoC)
PDF  197 Pages
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производитель  MICROSEMI [Microsemi Corporation]
домашняя страница  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

IO20PDB0V0 датащи(HTML) 36 Page - Microsemi Corporation

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SmartFusion DC and Switching Characteristics
2- 24
R e v i sio n 1 2
Summary of I/O Timing Characteristics – Default I/O Software
Settings
Table 2-21 • Summary of Maximum and Minimum DC Input Levels
Applicable to Commercial Conditions in all I/O Bank Types
DC I/O Standards
Commercial
IIL
IIH
µA
µA
3.3 V LVTTL / 3.3 V LVCMOS
15
15
2.5 V LVCMOS
15
15
1.8 V LVCMOS
15
15
1.5 V LVCMOS
15
15
3.3 V PCI
15
15
3.3 V PCI-X
15
15
Table 2-22 • Summary of AC Measuring Points Applicable to All I/O Bank Types
Standard
Measuring Trip Point (Vtrip)
3.3 V LVTTL / 3.3 V LVCMOS
1.4 V
2.5 V LVCMOS
1.2 V
1.8 V LVCMOS
0.90 V
1.5 V LVCMOS
0.75 V
3.3 V PCI
0.285 * VCCxxxxIOBx (RR)
0.615 * VCCxxxxIOBx (FF)
3.3 V PCI-X
0.285 * VCCxxxxIOBx (RR)
0.615 * VCCxxxxIOBx (FF)
LVDS
Cross point
LVPECL
Cross point
Table 2-23 • I/O AC Parameter Definitions
Parameter
Parameter Definition
tDP
Data to pad delay through the output buffer
tPY
Pad to data delay through the input buffer
tDOUT
Data to output buffer delay through the I/O interface
tEOUT
Enable to output buffer tristate control delay through the I/O interface
tDIN
Input buffer to data delay through the I/O interface
tHZ
Enable to pad delay through the output buffer—High to Z
tZH
Enable to pad delay through the output buffer—Z to High
tLZ
Enable to pad delay through the output buffer—Low to Z
tZL
Enable to pad delay through the output buffer—Z to Low
tZHS
Enable to pad delay through the output buffer with delayed enable—Z to High
tZLS
Enable to pad delay through the output buffer with delayed enable—Z to Low



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