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ZADCS147 датащи(PDF) 23 Page - List of Unclassifed Manufacturers |
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ZADCS147 датащи(HTML) 23 Page - List of Unclassifed Manufacturers |
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23 / 26 page ![]() ZADCS146/147 12-Bit, 200ksps, ADC Family Data Sheet October 12, 2011 © 2011 Zentrum Mikroelektronik Dresden AG — Rev. 2.0 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is PRELIMINARY and subject to changes without notice. 23 of 25 3 Layout To achieve optimum conversion performance care must be taken in design and layout of the application board. It is highly recommended to use printed circuit boards instead of wire wrap designs and to establish a single point star connection ground system towards AGND (see Figure 17). For optimal noise performance the star point should be located very close to the AGND pin of the converter. The ground return to the power supply should be as short as possible and low impedance. All other analog ground points of external circuitry that is related to the A/D converter as well as the DGND pin of the device should be connected to this ground point too. Any other digital ground system should be kept apart as far as possible and connect on the power supply point only. Analog and digital signal domains should also be separated as well as possible and analog input signals should be shielded by AGND ground planes from electromagnetic interferences. Four-layer PCB boards that allow smaller vertical distances between the ground plane and the shielded signals do generally show a better performance than two-layer boards. The sampling phase is the most critical portion of the overall conversion timing for signal distortion. If possible, the switching of any high power devices or nearby digital logic should be avoided during the sampling phase of the converter. Current consumption vs. Sample Rate External Clock Mode, External VREF, fSCLK = 3.3MHz 1 10 100 1000 10000 1 10 100 1000 Sample Rate (ksps) Figure 16: Supply Current versus Sampling Rate Figure 17: Optimal Power-Supply Grounding System Optional R = 10Ω VDD1 (+2.7 … +5.25V) ZADCS146 ZADCS147 COM DGND Other DGND GND Digital DVDD Circuitry VDD2 The fully differential internal architecture of the ZADCS146 and ZADCS147 ensures very good suppression of power supply noise. Nevertheless, the SAR architecture is generally sensitive to glitches or sudden changes of the power supply that occur shortly before the latching of the comparator output. It is therefore recommended to bypass the power supply connection very close to the device with capacitors of 0.1µF (ceramic) and >1µF (electrolytic). In case of a noisy supply, an additional series resistor of 5 to 10 ohms can be used to low-pass filter the supply voltage. The reference voltage should always be bypassed with capacitors of 0.1µF (ceramic) and ≥ 4.7µF (electrolytic) as close as possible to the VREF pin. If VREF is provided by an external source, any series resistance in the VREF supply path can cause a gain error of the converter. During conversion, a DC current of about 100µA is drawn through the VREF pin that could cause a noticeable voltage drop across the resistance. |
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