S29GL01GS datasheet(97/106 Pages) SPANSION

97 / 106 page

October 9, 2013 S29GL_128S_01GS_00_08

GL-S MirrorBit® Family

Data

She e t

11.3.2

Physical Diagram - VBU 056

12. Special Handling Instructions for FBGA Package

Special handling is required for Flash Memory products in FBGA packages.

Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The

package and/or data integrity may be compromised if the package body is exposed to temperatures above

150°C for prolonged periods of time.

SEATING PLANE

A1 CORNER

BOTTOM VIEW

0.10

(2X)

0.10

(2X)

SIDE VIEW

TOP VIEW

INDEX MARK

A1 CORNER

0.10

0.08

M C

0.08

0.15

56 b

g1055\ 16-038.25 \ 01.26.12

NOTES:

1. DIMENSIONING AND TOLERANCING METHODS PER

ASME Y14.5M-1994.

2. ALL DIMENSIONS ARE IN MILLIMETERS.

3. BALL POSITION DESIGNATION PER JEP95, SECTION

4.3, SPP-010.

e REPRESENTS THE SOLDER BALL GRID PITCH.

5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE

"D" DIRECTION.

SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE

"E" DIRECTION.

N IS THE TOTAL NUMBER OF POPULATED SOLDER

BALL POSITIONS FOR MATRIX SIZE MD X ME.

DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL

DIAMETER IN A PLANE PARALLEL TO DATUM C.

SD AND SE ARE MEASURED WITH RESPECT TO DATUMS

A AND B AND DEFINE THE POSITION OF THE CENTER

SOLDER BALL IN THE OUTER ROW.

WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN

THE OUTER ROW SD OR SE = 0.000.

WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN

THE OUTER ROW, SD OR SE = e/2

8. "+" INDICATES THE THEORETICAL CENTER OF

DEPOPULATED BALLS.

A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK

MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.

10. OUTLINE AND DIMENSIONS PER CUSTOMER REQUIREMENT.

PACKAGE

VBU 056

JEDEC

N/A

9.00 mm x 7.00 mm NOM

PACKAGE

SYMBOL

MIN

NOM

MAX

NOTE

---

1.00

OVERALL THICKNESS

0.17

---

BALL HEIGHT

9.00 BSC.

BODY SIZE

7.00 BSC.

BODY SIZE

5.60 BSC.

BALL FOOTPRINT

5.60 BSC.

BALL FOOTPRINT

ROW MATRIX SIZE D DIRECTION

ROW MATRIX SIZE E DIRECTION

TOTAL BALL COUNT

0.35

0.40

0.45

BALL DIAMETER

0.80 BSC.

BALL PITCH

SD / SE

0.40 BSC.

SOLDER BALL PLACEMENT

A1,A8,D4,D5,E4,E5,H1,H8

DEPOPULATED SOLDER BALLS

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