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LP3906 датащи(PDF) 7 Page - Texas Instruments

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номер детали LP3906
подробное описание детали  Dual High-Current Step-Down DC/DC and Dual Linear Regulator with I2C ompatible
PDF  47 Pages
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производитель  TI [Texas Instruments]
домашняя страница  http://www.ti.com
Logo TI - Texas Instruments

LP3906 датащи(HTML) 7 Page - Texas Instruments

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LP3906
www.ti.com
SNVS456M – AUGUST 2006 – REVISED MAY 2013
OPERATING RATINGS
(1) (2) (3)
Bucks
VIN
2.7V to 5.5V
VEN
0 to (VIN + 0.3V)
Junction Temperature (TJ) Range
−40°C to +125°C
Ambient Temperature (TA) Range
(4)
−40°C to +85°C
Thermal Properties(5)(6) (4)
Junction-to-Ambient Thermal Resistance
(
θJA)NHZ0024B
28°C/W
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is specified. Operating Ratings do not imply specified performance limits. For specified performance limits
and associated test conditions, see the Electrical Characteristics.
(2)
All voltages are with respect to the potential at the GND pin.
(3)
Min and Max limits are ensured by design, test, or statistical analysis. Typical numbers are not specifications, but do represent the most
likely norm.
(4)
Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design.
(5)
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 160°C (typ.) and
disengages at TJ = 140°C (typ.)
(6)
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =
125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the
part/package in the application (
θJA), as given by the following equation: TA-MAX = TJ-MAX-OP − (θJA × PD-MAX). See APPLICATION
NOTES.
GENERAL ELECTRICAL CHARACTERISTICS
(1) (2) (3) (4)
Unless otherwise noted, VIN = 3.6V, Typical values and limits appearing in normal type apply for TJ = 25°C. Limits appearing
in boldface type apply over the entire junction temperature range for operation,
−40°C to +125°C.
Parameter
Test Conditions
Min
Typ
Max
Units
VPOR
Power-On Reset Threshold
VDD Falling Edge
1.9
V
TSD
Thermal Shutdown Threshold
160
°C
TSDH
Themal Shutdown Hysteresis
20
°C
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is specified. Operating Ratings do not imply specified performance limits. For specified performance limits
and associated test conditions, see the Electrical Characteristics.
(2)
All voltages are with respect to the potential at the GND pin.
(3)
Min and Max limits are specified by design, test, or statistical analysis. Typical numbers are not specified, but do represent the most
likely norm.
(4)
This specification is ensured by design.
I
2C COMPATIBLE INTERFACE ELECTRICAL SPECIFICATIONS(1)
Unless otherwise noted, VIN = 3.6V. Typical values and limits appearing in normal type apply for TJ = 25°C. Limits appearing
in boldface type apply over the entire junction temperature range for operation,
−40°C to +125°C
Parameter
Test Conditions
Min
Typ
Max
Units
FCLK
Clock Frequency
400
kHz
tBF
Bus-Free Time Between Start and Stop
See(1)
1.3
µs
tHOLD
Hold Time Repeated Start Condition
See(1)
0.6
µs
tCLKLP
CLK Low Period
See(1)
1.3
µs
tCLKHP
CLK High Period
See(1)
0.6
µs
tSU
Set Up Time Repeated Start Condition
See(1)
0.6
µs
tDATAHLD
Data Hold time
See(1)
0
µs
tDATASU
Data Set Up Time
See(1)
100
ns
TSU
Set Up Time for Start Condition
See(1)
0.6
µs
TTRANS
Maximum Pulse Width of Spikes that
See(1)
Must be Suppressed by the Input Filter of
50
ns
Both DATA & CLK Signals.
(1)
This specification is ensured by design.
Copyright © 2006–2013, Texas Instruments Incorporated
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