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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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82563EB датащи(PDF) 45 Page - Intel Corporation |
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82563EB датащи(HTML) 45 Page - Intel Corporation |
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45 / 52 page  82563EB/82564EB Gigabit Platform LAN Connect Networking Silicon 39 5.2 Thermal Specifications The 82563EB/82564EB device is specified for operation when the ambient temperature (TA) is within the range of 0° C to 60° C. The maximum junction temperature is 120° C. The maximum ambient temperature with airflow and/or a heatsink can be calculated using the thermal coefficient data below and the power specification (see section 4.7) TC (case temperature) is calculated using the equation: TC = TA + P (θJA - θJC) TJ (junction temperature) is calculated using the equation: TJ = TA + P θJA P (power consumption) is calculated by using the typical ICC, as indicated in Table 38, and nominal VCC. The preliminary thermal resistances are shown in Table 38. Table 38. Thermal Characteristics Value @ Given Airflow (m/s) Symbol Parameter 0 1 2 3 Units θJ A Thermal Resistance, Junction to Ambient 26.1 22.9 21.7 21.1 °C/watt θJ C Thermal Resistance, Junction to Case 12.7 - - - °C/watt |
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