DAC8420

REV. 0

–4–

WAFER TEST LIMITS

DAC8420G

Parameter

Symbol

Conditions

Limit

Units

Integral Linearity

INL

±1

LSB max

Differential Linearity

DNL

±1

LSB max

Min-Scale Offset

±1

LSB max

Max-Scale Offset

±1

LSB max

Logic Input High Voltage

2.4

V min

Logic Input Low Voltage

0.8

V max

Logic Input Current

1

µA max

Positive Supply Current

8

mA max

Negative Supply Current

7

mA max

NOTE

Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed

for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing.

ABSOLUTE MAXIMUM RATINGS

Output Short Circuit Duration . . . . . . . . . . . . . . . . Indefinite

Operating Temperature Range

EP, FP, ES, FS, EQ, FQ . . . . . . . . . . . . . . –40

°C to +85°C

Dice Junction Temperature . . . . . . . . . . . . . . . . . . . . . +150

°C

Storage Temperature . . . . . . . . . . . . . . . . . . –65

°C to +150°C

Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . 1000 mW

Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . . +300

°C

Thermal Resistance

Package Type

θ

JA

θ

JC

Units

16-Pin Plastic DIP (P)

70

1

27

°C/W

16-Pin Hermetic DIP (Q)

82

1

9

°C/W

16-Lead Small Outline

Surface Mount (S)

86

2

22

°C/W

NOTES

1

θ

device in socket.

2

θ

CAUTION

1. Stresses above those listed under “Absolute Maximum Rat-

ings” may cause permanent damage to the device. This is a

stress rating only and functional operation at or above this

specification is not implied. Exposure to the above maximum

rating conditions for extended periods may affect device

reliability.

2. Digital inputs and outputs are protected, however, permanent

damage may occur on unprotected units from high-energy

electrostatic fields. Keep units in conductive foam or packaging

at all times until ready to use. Use proper antistatic handling

procedures.

3. Remove power before inserting or removing units from their

sockets.

4. Analog Outputs are protected from short circuits to ground

or either supply.

DICE CHARACTERISTICS

10

SDI

9

GND

8

VSS

7

VOUTA

CLR

15

CLSEL

16

(SUBSTRATE)

VDD

1

VOUTD

2

VOUTC 3

VREFLO 4

VREFHI 5

VOUTB 6

11 CLK

12 CS

14 LD

13 NC

NC = NO CONNECT

Die Size 0.119

× 0.283 inch, 33,677 sq. mils

(3.023

× 7.188 mm, 21.73 sq. mm)

Transistor Count 2,207

For additional DICE ordering information, refer to databook.

unless otherwise noted)