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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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PCF8523TS/1 датащи(PDF) 64 Page - NXP Semiconductors |
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PCF8523TS/1 датащи(HTML) 64 Page - NXP Semiconductors |
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64 / 75 page  PCF8523 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 4 — 5 July 2012 64 of 74 NXP Semiconductors PCF8523 Real-Time Clock (RTC) and calendar For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 19. Footprint information MSL: Moisture Sensitivity Level Fig 45. Temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = MSL limit, damage level peak temperature Fig 46. Footprint information for reflow soldering of SOT96-1 (SO8) of PCF8523T sot096-1_fr occupied area solder lands Dimensions in mm placement accuracy ± 0.25 1.30 0.60 (8 ×) 1.27 (6 ×) 4.00 6.60 5.50 7.00 |
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