PCF8523TSSLASH1 datasheet(58/75 Pages) NXP

58 / 75 page

PCF8523

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 4 — 5 July 2012

58 of 74

NXP Semiconductors

PCF8523

Real-Time Clock (RTC) and calendar

[1]

The x/y coordinates of the alignment mark location represent the position of the REF point (see Figure 41)

with respect to the center (x/y = 0) of the chip; see Figure 40.

[2]

The x/y values of the dimensions represent the extensions of the alignment mark in direction of the

coordinate axis (see Figure 41).

[1]

Pressure of diamond head: 10 g to 50 g.

Table 51.

Bump locations

All x/y coordinates represent the position of the center of each bump with respect to the center

(x/y = 0) of the chip; see Figure 40.

Symbol

Bump

Coordinates (

m)

VDD

714.4

911.7

OSCI

714.4

988.3

OSCO

714.4

707.3

VBAT

714.4

199.3

VSS

714.4

459.1

n.c.

714.4

616.7

INT2

714.4

895.4

CLKOUT

714.4

922.0

SDA

714.4

528.8

SCL

714.4

101.1

n.c.

714.4

607.6

INT1/CLKOUT

714.4

763.2

Table 52.

Alignment mark dimension and location

Coordinates

Location[1]

631.3

m

891.7

m

Dimension[2]

44.25

m

36.5

m

Fig 41. Alignment mark

Table 53.

Gold bump hardness of PCF8523U

Gold bump type

Min

Max

Unit[1]

soft gold bump

013aaa318

REF

PCF8523TS/1 датащи(PDF) 58 Page - NXP Semiconductors

PCF8523TS/1 датащи(HTML) 58 Page - NXP Semiconductors

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75

датащи скачать

ссылки URL