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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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PCF8523TS/1 датащи(PDF) 60 Page - NXP Semiconductors |
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PCF8523TS/1 датащи(HTML) 60 Page - NXP Semiconductors |
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60 / 75 page  PCF8523 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 4 — 5 July 2012 60 of 74 NXP Semiconductors PCF8523 Real-Time Clock (RTC) and calendar 17.2 Wafer and Film Frame Carrier (FFC) information SOT402-1 (TSSOP14) of PCF8523TS A0 pocket width in x direction 6.95 mm B0 pocket width in y direction 5.6 mm K0 pocket depth 1.6 mm P1 pocket hole pitch 8.0 mm W tape width in y direction 12.0 mm Table 54. Carrier tape dimensions of PCF8523 …continued Symbol Description Value Unit (1) Die marking code. Seal ring plus gap to active circuit ~18 m. Wafer thickness 200 m. PCF8523U: bad die are marked in wafer mapping. Fig 43. PCF8523U wafer information 013aaa232 Saw lane ~18 μm 45 μm 70 μm ~18 μm detail X 1.449 mm 1.492 mm 1 1 1 1 X straight edge of the wafer (1) |
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