DAC1282

SBAS490

– DECEMBER 2011

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION

For the most current package and ordering information see the Package Option Addendum at the end of this

document, or see the TI web site at www.ti.com.

RELATED PRODUCTS

DESCRIPTION

DEVICE

High-resolution ADC

ADS1281

High-resolution ADC with PGA

ADS1282

Low-drift 5 V reference

REF5050

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range, unless otherwise noted.

DAC1282

MIN

MAX

UNIT

AVDD to AVSS

–0.3

+5.5

V

AVSS to DGND

–2.8

+0.3

V

DVDD to DGND

–0.3

+3.6

V

Input current continuous

–10

+10

mA

Analog input/output voltage

AVSS

– 0.3

AVDD + 0.3

V

Switch current

–60

+60

mA

Digital input voltage to DGND

–0.3

DVDD + 0.3

V

Operating temperature range

–50

+125

°C

Storage temperature range

–60

+150

°C

JEDEC standard 22, test

V

Human body model (HBM)

±2000

method A114-C.01, all pins

ESD ratings

JEDEC standard 22, test

V

Charge device model (CDM)

±500

method C101, all pins

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

2

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© 2011, Texas Instruments Incorporated

Product Folder Link(s): DAC1282