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UCD3138 датащи(PDF) 57 Page - Texas Instruments |
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UCD3138 датащи(HTML) 57 Page - Texas Instruments |
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57 / 68 page ![]() UCD3138 www.ti.com SLUSAP2 A – MARCH 2012 – REVISED MARCH 2012 5 IC Grounding and Layout Recommendations • Two grounds are recommended: AGND (analog) and DGND (digital). – AGND plane should be on a different layer than DGND, and right under the UCD3xxx device. – UCD3xxx power pad should be tied to AGND plane by at least 4 vias – AGND plane should be just large enough to connect to all required components. – Power ground (PGND) can be independent or combined with DGND • Both 3.3VD and 3.3VA should have a local 0.1µF capacitor placed as close as possible to the device pins • BPCAP decoupling (2.2 µF typically) MUST be connected to DGND • All analog signal filter capacitors should be tied to AGND – If the UCD7201 or UCD7100 driver is used, the filter capacitor for the current sensing pin can be tied to DGND for easy layout • All digital signals, such as GPIO, PMBus and PWM are referenced to DGND. • The RESET pin capacitor (0.1µF) should be connected to either DGND or AGND locally. A 10k Ω pull- up resistor to 3.3V is recommended. • All filter and decoupling capacitors should be placed close to UCD3xxx as possible – Resistor placement is less critical and can be moved a little further away • The DGND and AGND net-short resistor MUST be placed right between one UCD3xxx’s DGND pin and one AGND pin. Ground connections to the net short element should be made by a large via (or multiple paralleled vias) for each terminal of the net-short element. • If a UCD7201 or UCD7100 device is on the control card and there is a PGND connection, a net-short resistor should be tied to the DGND plane and PGND plane by multiple vias. In addition the net-short element should be close to the driver IC. – The power pad of the driver IC should be tied to DGND Copyright © 2012, Texas Instruments Incorporated IC Grounding and Layout Recommendations 57 Submit Documentation Feedback Product Folder Link(s): UCD3138 |
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