TLE7269G

Functional Description

Data Sheet

18

Rev. 1.2, 2007-11-13

4.12

Over Temperature protection

The TLE7269G has one integrated over temperature sensor to protect the device against thermal overstress on

the output stage 1 and output stage 2. In case of an over temperature event, the temperature sensor will disable

both output stages (see Figure 1). An over temperature event will not cause any mode change nor will it be

signaled by either the RxD pins or the TxD pins. When the junction temperature falls below the thermal shut down

level

T

10°C hysteresis avoids toggling during the temperature shut down.

4.13

3.3 V and 5 V Logic Capability

The TLE7269G can be used for 3.3 V and 5 V microcontrollers. The inputs and the outputs are capable to operate

with both voltage levels. The logic level is defined by suppling 3.3V or 5V to the

V

the reference voltage from the

V

voltage given by

V

The pin EN works without the voltage on the microcontroller supply

V

mode to Normal Operation mode by setting EN to “High”, without supplying

V

4.14

BUS Short to GND Feature

The TLE7269G has a feature implemented to protect the battery from running out of charge in the case of BUS

short to GND failure.

In this failure case a normal master termination, a 1 k

Ω resistor and diode between the LIN bus and the power

GND is in the range 1 k

Ω. To avoid this current during a generator off state, like in a parked car, the TLE7269G

has a bus short to GND feature implemented, which is activated in Sleep mode.

This feature is only applicable, if the master termination of BUS1 is connected to INH1 pin and the master

and Figure 18). Internally, the 30 k

Ω path is also switched off from the power supply V

A separate Master Termination Switch is implemented at pins BUS1 and BUS2, to avoid a voltage drop on the

recessive level of LIN bus, in case of a dominant level or a short to ground on at the LIN bus.

4.15

LIN Specifications 1.2, 1.3, 2.0 and 2.1

The device fulfills the Physical Layer Specification of LIN 1.2, 1.3, 2.0 and 2.1.

The differences between LIN specification 1.2 and 1.3 is mainly the physical layer specification. The reason was

to improve the compatibility between the nodes.

The LIN specification 2.0 is a super set of the 1.3 version. The 2.0 version offers new features. However, it is

possible to use the LIN 1.3 slave node in a 2.0 node cluster, as long as the new features are not used. Vice versa

it is possible to use a LIN 2.0 node in the 1.3 cluster without using the new features.

In terms of the physical layer the LIN 2.1 Specification doesn’t include any changes and is fully compliant to the

LIN Specification 2.0.

LIN 2.1 is the latest version of the LIN specification, released in December 2006.