S5000PAL datasheet(25/112 Pages) INTEL

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Functional Architecture

Intel

® Server Board S5000PAL / S5000XAL TPS

Revision 1.7

Intel order number: D31979-010

3.1.2.1

Processor Population Rules

When two processors are installed, both must be of identical revision, core voltage, and bus/core speed.

Mixed processor steppings is supported. However, the stepping of one processor cannot be greater than

one stepping back of the other. When only one processor is installed, it must be in the socket labeled

CPU1. The other socket must be empty.

The board is designed to provide up to 130A of current per processor. Processors with higher current

requirements are not supported.

No terminator is required in the second processor socket when using a single processor configuration.

3.1.2.2

Common Enabling Kit (CEK) Design Support

The server board complies with Intel’s Common Enabling Kit (CEK) processor mounting and heat sink

retention solution. The server board ships with a CEK spring snapped onto the underside of the server

board, beneath each processor socket. The heat sink attaches to the CEK, over the top of the processor

and the thermal interface material (TIM). See the figure below for the stacking order of the chassis, CEK

spring, server board, TIM, and heat sink.

The CEK spring is removable, allowing for the use of non-Intel heat sink retention solutions.

Note:

The processor heat sink and CEK spring shown in the following diagram are for reference

purposes only. The actual processor heat sink and CEK solutions compatible with this generation server

board may be of a different design.

Heatsink assembly

Thermal interface material (TIM)

Server board

CEK spring

Chassis

Figure 10. CEK Processor Mounting

3.1.3

Memory Sub-system

On the Intel® Server Board S5000PAL / S5000XAL, the MCH provides four channels of Fully Buffered

DIMM (FB-DIMM) memory. Each channel can support up to 2 Dual Ranked FB-DIMM DDR2 DIMMs. FB-

DIMM memory channels are organized in to two branches for support of RAID 1 (mirroring). The MCH

can support up to 8 DIMMs or a maximum memory size of 32 GB physical memory in non-mirrored mode

and 16 GB physical memory in a mirrored configuration. The read bandwidth for each FB-DIMM channel

is 4.25 GB/s for DDR2 533 FB-DIMM memory which gives a total read bandwidth of 17 GB/s for four FB-

DIMM channels. Thus, this provides 8.5 GB/s of write memory bandwidth for four FB-DIMM channels.

The read bandwidth for each FB-DIMM channel is 5.3GB/s for DDR2 667 FB-DIMM memory which gives

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