PCA2003USLASH10ACSLASH1 datasheet(18/21 Pages) NXP

номер детали	PCA2003U/10AC/1

подробное описание детали	32 kHz watch circuit with programmable adaptive motor pulse and pulse period

PDF	21 Pages

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производитель	NXP [NXP Semiconductors]

домашняя страница	http://www.nxp.com

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PCA2003_2

Product data sheet

Rev. 02 — 21 July 2009

18 of 21

NXP Semiconductors

PCA2003

32 kHz watch circuit with programmable adaptive motor pulse

11. Bare die outline

[1]

All coordinates are referenced, in

µm, to the center of the die (see Figure 13).

[2]

The substrate (rear side of the chip) is connected to VSS. Therefore the die pad must be either ﬂoating or

connected to VSS.

[3]

Pad i.c. is used for factory tests; in normal operation it should be left open-circuit, and it has an internal

pull-down resistance to VSS.

Fig 13. Bare die outline PCA2003U

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

PCA200xU

Wire bond die; 8 bonding pads; 1.16 x 0.86 x 0.22 mm

PCA200xU

UNIT

max

nom

min

0.22

0.20

0.18

1.16

0.17

0.32

0.96

0.099

0.096

0.093

0.099

0.096

0.093

DIMENSIONS (mm are the original dimensions)

0.5

1 mm

scale

0.86

0.089

0.086

0.083

0.089

0.086

0.083

detail X

08-05-09

08-05-21

Table 12.

Bonding pad locations

Symbol

Pad

Coordinates[1]

VSS[2]

−480

+330

i.c.[3]

−480

+160

OSCIN

−480

−160

OSCOUT

−480

−330

VDD

+480

−330

MOT1

+480

−160

MOT2

+480

+160

RESET

+480

+330

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