TSB12C01APZ datasheet(41/59 Pages) TI

41 / 59 page

5–1

5 Electrical Characteristics

5.1

Absolute Maximum Ratings Over Free-Air Temperature Range (Unless

Otherwise Noted)†

Supply voltage range, VCC (see Note 1)

– 0.5 V to 6 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage range, at any input, VI

– 0.5 V to VCC + 0.5 V

. . . . . . . . . . . . . . . . . . . . . . . .

Output voltage range, VO

– 0.5 V to VCC + 0.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 2)

±20 mA

. . . . . . . . . . . . . . . . . .

Continuous total power dissipation

See Maximum Dissipation Rating Table

. . . . . . . . . .

Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 3)

±20 mA

. . . . . . . . . . . . . .

Operating free-air temperature range, TA: A suffix

°C to 70°C

. . . . . . . . . . . . . . . . . . . . .

AI suffix

– 40

°C to 85°C

. . . . . . . . . . . . . . . . . .

AM suffix

– 55

°C to 125°C

. . . . . . . . . . . . . . . .

Storage temperature range, Tstg

–65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Case temperature for 10 seconds, TC

260

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These

are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated

under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for

extended periods may affect device reliability.

NOTES:

1. All voltage values are with respect to GND.

2. This applies to all inputs.

3. This applies to all outputs.

MAXIMUM DISSIPATION RATING TABLE‡

PACKAGE

TA ≤ 25°C

DERATING

FACTOR

TA = 70°C

TA = 85°C

TA = 125°C

PACKAGE

POWER RATING

FACTOR

ABOVE TA = 25°C

POWER RATING

2119 mW

2404 mW

16.9 mW/

°C

19.2 mW/

°C

1356 mW

1538 mW

1102 mW

1250 mW

—

481 mW

‡ Power dissipation of package based on an absolute maximum junction temperature of 150

°C.

PACKAGE THERMAL CHARACTERISTICS§

PARAMETER

TEST

PZ PACKAGE

WN PACKAGE

UNIT

PARAMETER

TEST

CONDITIONS

MIN

NOM

MAX

MIN

NOM

MAX

UNIT

θJA

Junction-to-ambient thermal

impedance

Board mounted,

No air flow

°C/W

θJC

Junction-to-case thermal

impedance

°C/W

§ Thermal characteristics very depending on die and leadframe pad size as well as mold compound. These values

represent typical die and pad sizes for the respective packages. The R value decreases as the die or pad sizes

increases. Thermal values represent PWB bands with minimal amounts of metal.

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