| поискавой системы для электроныых деталей |
|
SC417 датащи(PDF) 25 Page - Semtech Corporation |
|
|
|||||||||||||||||||||||||||||
SC417 датащи(HTML) 25 Page - Semtech Corporation |
|
25 / 29 page ![]() SC417/SC427 25 Applications Information (continued) PCB Layout Guidelines The optimum layout for the SC417/SC427 is shown in Figure 15. The layout highlights the device as a space saving and high performance solution. This layout shows an integrated FET buck regulator with a maximum current of 10A. The total PCB area is approximately 20 x 25 mm. This figure shows the total area and optimum layout for the device. If optimum layout is not possible due to PCB limitations, the following generic guidelines should be followed. Generic Layout Guidelines One or more ground planes are recommended to mini- mize the effect of switching noise, resistive losses, and to maximize heat removal. The analog ground reference AGND should connect directly to the AGND pad and pins. An AGND plane or island should be used near the device. All components that are referenced to AGND should connect directly to this plane and mounted on the IC side of the PCB. AGND should connect to PGND (power ground) using an external zero ohm resistor or using a short PCB trace. Connect AGND to PGND only at one place, as near to the AGND and PGND pins as is practical. Power ground (PGND) should be a separate plane which is not used for routing analog traces. All PGND connections should connect directly to the PGND plane. Indirect connections between AGND and GND which will create ground loops should be avoided. The V5V input provides power to the internal analog cir- cuits and the upper and lower gate drivers. The V5V supply decoupling capacitors should be tied between V5V and PGND with short traces. The switcher power section should be connected directly to the PGND plane(s) using multiple vias as required for VOUT Plane on Top layer L CLDO CIN CFF RFB2 RFB1 RILIM RLDO2 RLDO1 LX plane on inner or bottom layer All components shown Top Side AGND plane on inner layer VIN plane on inner or bottom layer RGND — AGND connects to PGND close to SC417/SC427 Pin 1 marking SC417/SC427 with vias for LX, AGND, VIN COUT PGND on inner or bottom layer PGND on Top layer PGND Figure 15 — PCB Layout |
|
ссылки URL |
| Вашему бизинису помогли Аллдатащит? [ DONATE ] |
Что такое Аллдатащит | реклама | контакт | Конфиденциальность | Ссылка на техническое описание | обмен ссыками | поиск по производителю All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |