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SPC5702BECLU датащи(PDF) 55 Page - Freescale Semiconductor, Inc |
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SPC5702BECLU датащи(HTML) 55 Page - Freescale Semiconductor, Inc |
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55 / 98 page ![]() Electrical Characteristics MPC560xS Microcontroller Data Sheet Data Sheet, Rev. 1 Preliminary—Subject to Change Without Notice Freescale Semiconductor 55 3.6.4 I/O Pad Current Specification The I/O pads are distributed across the I/O supply segment. Each I/O supply segment is associated to a VDD/VSS supply pair as described in Table 22. Table 23 provides I/O consumption figures. In order to ensure device reliability, the average current of the I/O on a single segment should remain below the IAVGSEG maximum value. In order to ensure device functionality, the sum of the dynamic and static current of the I/O on a single segment should remain below the IDYNSEG maximum value. Table 22. I/O Supply Segment Package Supply segment A1 1 LCD pad segment containing pad supplies V DDE_A B2 2 Misc. pad segment containing pad supplies V DDE_B C3,4 3 ADC pad segment containing pad supplies V DDE_C 4 ADC V DDA and VDDE_C should be at the same voltage level D5 5 Stepper Motor pad segment containing I/O supplies V DDMA, VDDMB, VDDMC E6 6 Misc pad segment containing pad supplies V DDE_E 144 LQFP pins 1 - 21 pins 113 - 144 pins 22 - 52 pins 53 - 72 pins 73 - 102 pins 103 - 112 176 LQFP pins 1 - 21 pins 143 - 176 pins 22 - 68 pins 69 - 88 pins 89 - 118 pins 119 - 142 Table 23. I/O Consumption Symbol Parameter Conditions1 Value2 Unit Min Typ Max ISWTSLW CC 3 Dynamic I/O current for SLOW configuration CL = 25pF, VDD = 5.0V ± 10%, ipp_hve = 0 20 mA CL = 25pF, VDD = 3.3V ± 10%, ipp_hve = 1 16 ISWTMED CC 3 Dynamic I/O current for MEDIUM configuration CL = 25pF, VDD = 5.0V ± 10%, ipp_hve = 0 29 mA CL = 25pF, VDD = 3.3V ± 10%, ipp_hve = 1 17 ISWTFST 3 CC3 Dynamic I/O current for FAST configuration CL = 25pF, VDD = 5.0V ± 10%, ipp_hve = 0 110 mA CL = 25pF, VDD = 3.3V ± 10%, ipp_hve = 1 50 |
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