SPC5702BECLU datasheet(44/98 Pages) FREESCALE

44 / 98 page

MPC560xS Microcontroller Data Sheet Data Sheet, Rev. 1

Preliminary—Subject to Change Without Notice

Electrical Characteristics

Freescale Semiconductor

3.2

Thermal Characteristics

Table 11. Thermal Characteristics for 144-pin LQFP1

1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.

Symbol

Parameter

Conditions

Value

Unit

RθJA

Junction to Ambient Natural Convection2

2 Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board

meets JEDEC specification for this package.

Single layer board - 1s

°C/W

RθJA

Junction to Ambient Natural Convection2

Four layer board - 2s2p

°C/W

RθJMA

Junction to Ambient2

@200 ft./min., single layer

board - 1s

°C/W

RθJMA

Junction to Ambient2

@200 ft./min., four layer

board- 2s2p

°C/W

RθJB

Junction to Board3

3 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC

specification for the specified package.

°C/W

RθJCtop

Junction to Case4

4 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate

temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.

°C/W

Junction to Package Top Natural

Convection5

5 Thermal characterization parameter indicating the temperature difference between the package top and the

junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization

parameter is written as Psi-JT.

2°C/W

Table 12. Thermal Characteristics for 176-pin LQFP1

1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.

Symbol

Parameter

Conditions

Value

Unit

RθJA

Junction to Ambient Natural Convection2

2 Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board

meets JEDEC specification for this package.

Single layer board - 1s

°C/W

RθJA

Junction to Ambient Natural Convection2

Four layer board - 2s2p

°C/W

RθJMA

Junction to Ambient2

@200 ft./min., single layer

board - 1s

°C/W

RθJMA

Junction to Ambient2

@200 ft./min., Four layer

board - 2s2p

°C/W

RθJB

Junction to Board3

3 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC

specification for the specified package.

°C/W

RθJCtop

Junction to Case (Top)4

4 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate

temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.

9°C/W

Junction to Package Top Natural

Convection5

5 Thermal characterization parameter indicating the temperature difference between the package top and the

junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization

parameter is written as Psi-JT.

2°C/W

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