MPC5510 datasheet(23/54 Pages) FREESCALE

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Electrical Characteristics

MPC5510 Microcontroller Family Data Sheet, Rev. 2

Preliminary—Subject to Change Without Notice

Freescale Semiconductor

device. This description is most useful for packages with heat sinks where some 90% of the heat flow is through the case to the

heat sink to ambient. For most packages, a better model is required.

A more accurate two-resistor thermal model can be constructed from the junction to board thermal resistance and the junction

to case thermal resistance. The junction to case covers the situation where a heat sink will be used or where a substantial amount

of heat is dissipated from the top of the package. The junction to board thermal resistance describes the thermal performance

when most of the heat is conducted to the printed circuit board. This model can be used for either hand estimations or for a

computational fluid dynamics (CFD) thermal model.

To determine the junction temperature of the device in the application after prototypes are available, the Thermal

Characterization Parameter (

JT) can be used to determine the junction temperature with a measurement of the temperature at

the top center of the package case using the following equation:

TJ = TT + (ΨJT × PD)

Eqn. 14

where:

TT = thermocouple temperature on top of the package (

oC)

Eqn. 15

JT = thermal characterization parameter (

oC/W)

Eqn. 16

PD = power dissipation in the package (W)

Eqn. 17

The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T thermocouple epoxied

to the top center of the package case. The thermocouple should be positioned so that the thermocouple junction rests on the

package. A small amount of epoxy is placed over the thermocouple junction and over about 1 mm of wire extending from the

junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling effects

of the thermocouple wire.

References:

Semiconductor Equipment and Materials International

805 East Middlefield Rd

Mountain View, CA 94043

(415) 964-5111

MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at 800-854-7179 or

303-397-7956.

JEDEC specifications are available on the WEB at http://www.jedec.org.

C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive Engine

Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.

G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled Applications,” Electronic

Packaging and Production, pp. 53–58, March 1998.

B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and Its Application

in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212–220.

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