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L6722 датащи(PDF) 31 Page - STMicroelectronics

номер детали L6722
подробное описание детали  3 Phase controller for DC/DC converters
PDF  34 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

L6722 датащи(HTML) 31 Page - STMicroelectronics

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L6722
12 Layout guidelines
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Remote Sense Connection must be routed as parallel nets from the FBG/FBR pins to the load
in order to avoid the pick-up of any common mode noise. Connecting these pins in points far
from the load will cause a non-optimum load regulation, increasing output tolerance.
Locate current reading components close to the device. It's also important to minimize any
offset in the measurement and, to get a better precision, to connect the traces as close as
possible to the sensing elements.
Caution:
Boot capacitor extra charge. Systems that do not use Schottky diodes in parallel to the low-
side mosfet might show big negative spikes on the phase pin. This spike can be limited as well
as the positive spike but has an additional consequence: it causes the bootstrap capacitor to be
over-charged. This extra-charge can cause, in the worst case condition of maximum input
voltage and during particular transients, that boot-to-phase voltage overcomes the abs. max.
ratings also causing device failures. It is then suggested in this cases to limit this extra-charge
by:
adding a small resistor in series to the boot diode (one resistor can be enough for all
the three diodes if placed upstream the boot diode anode, see Figure 18)
using non-capacitive boot diodes (such as standard diodes).
Figure 18. Power connections and related connections layout (same for all phases).
L
CIN
VIN
UGATEx
PHASEx
LGATEx
PGNDx
LOAD
BOOTx
PHASEx
VCC
SGND
+Vcc
L
CIN
VIN
LOAD
To limit C
BOOT
Extra-Charge



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