12 Layout guidelines

L6722

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12

Layout guidelines

Since the device manages control functions and high-current drivers, layout is one of the most

important things to consider when designing such high current applications. A good layout

solution can generate a benefit in lowering power dissipation on the power paths, reducing

radiation and a proper connection between signal and power ground can optimize the

performance of the control loops.

Two kind of critical components and connections have to be considered when layouting a VR

based on L6722: power components and connections and small signal components

connections.

12.1

Power components and connections

These are the components and connections where switching and high continuous current flows

from the input to the load. The first priority when placing components has to be reserved to this

power section, minimizing the length of each connection and loop as much as possible. To

minimize noise and voltage spikes (EMI and losses) these interconnections must be a part of a

power plane and anyway realized by wide and thick copper traces: loop must be anyway

minimized. The critical components, i.e. the power transistors, must be close one to the other.

The use of multi-layer printed circuit board is recommended.

Figure 18 shows the details of the power connections involved and the current loops. The input

to the power section in order to eliminate the stray inductance generated by the copper traces.

Low ESR and ESL capacitors are preferred, MLCC are suggested to be connected near the HS

drain.

Use proper VIAs number when power traces have to move between different planes on the

PCB in order to reduce both parasitic resistance and inductance. Moreover, reproducing the

same high-current trace on more than one PCB layer will reduce the parasitic resistance

associated to that connection.

Connect output bulk capacitor as near as possible to the load, minimizing parasitic inductance

and resistance associated to the copper trace also adding extra decoupling capacitors along

the way to the load when this results in being far from the bulk capacitor bank.

Gate traces must be sized according to the driver RMS current delivered to the power mosfet.

The device robustness allows managing applications with the power section far from the

controller without losing performances. Anyway, when possible, it is suggested to minimize the

distance between controller and power section.

12.2

Small signal components and connections

These are small signal components and connections to critical nodes of the application as well

as bypass capacitors for the device supply (See Figure 18). Locate the bypass capacitor (VCC

and Bootstrap capacitor) close to the device and refer sensible components such as frequency

and offset setup resistors to SGND. Star grounding is suggested: connect SGND to PGND

plane in a single point to avoid that drops due to the high current delivered causes errors in the

device behavior.