COMPONENT LOCATION

TRACE WIDTH

TPA2016D2

Figure 36. Land Pattern Dimensions

SOLDER PAD

COPPER

STENCIL

COPPER PAD

DEFINITIONS

OPENING

THICKNESS

THICKNESS

275

µm

375

µm

Non solder mask

275

µm × 275 µm Sq. (rounded

1 oz max (32

µm)

125

µm thick

defined (NSMD)

corners)

(+0.0, –25

µm)

(+0.0, –25

µm)

(1)

Circuit traces from NSMD defined PWB lands should be 75

µm to 100 µm wide in the exposed area inside the solder mask opening.

Wider trace widths reduce device stand off and impact reliability.

(2)

Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the

intended application.

(3)

Recommend solder paste is Type 3 or Type 4.

(4)

For a PWB using a Ni/Au surface finish, the gold thickness should be less 0.5 mm to avoid a reduction in thermal fatigue performance.

(5)

Solder mask thickness should be less than 20

µm on top of the copper circuit pattern

(6)

Best solder stencil performance is achieved using laser cut stencils with electro polishing. Use of chemically etched stencils results in

inferior solder paste volume control.

(7)

Trace routing away from WCSP device should be balanced in X and Y directions to avoid unintentional component movement due to

solder wetting forces.

the TPA2016D2 is important for the efficiency of the Class-D amplifier. Any resistance or inductance in the trace

between the device and the capacitor can cause a loss in efficiency.

Recommended trace width at the solder balls is 75

µm to 100 µm to prevent solder wicking onto wider PCB

traces. For high current pins (PVDD (L, R), PGND, and audio output pins) of the TPA2016D2, use 100-

µm trace

widths at the solder balls and at least 500-

µm PCB traces to ensure proper performance and output power for

the device. For the remaining signals of the TPA2016D2, use 75-

µm to 100-µm trace widths at the solder balls.

The audio input pins (INR± and INL±) must run side-by-side to maximize common-mode noise cancellation

28

Copyright © 2008, Texas Instruments Incorporated

Product Folder Link(s): TPA2016D2