поискавой системы для электроныых деталей
  Russian  ▼
ALLDATASHEETRU.COM

X  

PCA9601DPZ датащи(PDF) 30 Page - NXP Semiconductors

номер детали PCA9601DPZ
подробное описание детали  Dual bidirectional bus buffer
PDF  31 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
производитель  NXP [NXP Semiconductors]
домашняя страница  http://www.nxp.com
Logo NXP - NXP Semiconductors

PCA9601DPZ датащи(HTML) 30 Page - NXP Semiconductors

Back Button PCA9601DPZ Datasheet HTML 23Page - NXP Semiconductors PCA9601DPZ Datasheet HTML 24Page - NXP Semiconductors PCA9601DPZ Datasheet HTML 25Page - NXP Semiconductors PCA9601DPZ Datasheet HTML 26Page - NXP Semiconductors PCA9601DPZ Datasheet HTML 27Page - NXP Semiconductors PCA9601DPZ Datasheet HTML 28Page - NXP Semiconductors PCA9601DPZ Datasheet HTML 29Page - NXP Semiconductors PCA9601DPZ Datasheet HTML 30Page - NXP Semiconductors PCA9601DPZ Datasheet HTML 31Page - NXP Semiconductors  
Zoom Inzoom in Zoom Outzoom out
 30 / 31 page
background image
NXP Semiconductors
PCA9601
Dual bidirectional bus buffer
Tables
Tab. 1.
Ordering information ..........................................2
Tab. 2.
Ordering options ................................................2
Tab. 3.
Pin description ...................................................3
Tab. 4.
PCA9601/PCA9600 versus P82B96 ................. 5
Tab. 5.
Limiting values .................................................. 6
Tab. 6.
Characteristics ...................................................7
Tab. 7.
Examples of bus capability ............................. 13
Tab. 8.
SnPb eutectic process (from J-STD-020D) ..... 25
Tab. 9.
Lead-free process (from J-STD-020D) ............25
Tab. 10. Abbreviations ...................................................26
Tab. 11. Revision history ...............................................27
Figures
Fig. 1.
Block diagram of PCA9601 ...............................2
Fig. 2.
Pin configuration for SO8 ..................................3
Fig. 3.
Pin configuration for TSSOP8 (MSOP8) ........... 3
Fig. 4.
Equivalent circuit at SX/SY ............................. 10
Fig. 5.
VOL as a function of junction temperature
(IOL = 0.3 mA) ................................................10
Fig. 6.
VOL as a function of junction temperature
(IOL = 3 mA) ...................................................10
Fig. 7.
VIL as a function of junction temperature;
maximum and typical values ...........................10
Fig. 8.
VIH as a function of junction temperature;
minimum and typical values ............................10
Fig. 9.
VCC bus release limit over temperature;
maximum values ............................................. 11
Fig. 10.
Current sourced out of SX/SY as a function
of junction temperature if these pins are
externally pulled to 0.4 V or lower ...................11
Fig. 11.
Typical SX/SY current versus LOW-level
output voltage ..................................................11
Fig. 12.
Interfacing a standard 3 mA I2C-bus or
one with TTL levels (e.g. SMBus) to higher
voltage or higher current sink (e.g. Fast-
mode Plus) devices .........................................11
Fig. 13.
Galvanic isolation of I2C-bus nodes via
opto-couplers ...................................................12
Fig. 14.
Long distance I2C-bus communication ........... 12
Fig. 15.
Driving ribbon or flat telephone cables ............ 12
Fig. 16.
Falling edge of SCL at master is delayed
by the buffers and bus fall times ..................... 13
Fig. 17.
Rising edge of SCL at master is delayed
(clock stretch) by buffer and bus rise times ..... 14
Fig. 18.
Rising edge of SDA at slave is delayed by
the buffers and bus rise times .........................14
Fig. 19.
I2C-bus multipoint application ......................... 16
Fig. 20.
Propagation SX to TX with VRX = VCC =
3.3 V (SX pull-up to 3.3 V; TX pull-up to 5.7
V) .....................................................................16
Fig. 21.
Propagation SX to TX with RX tied to TX;
VCC = 3.3 V (SX pull-up to 3.3 V; TX pull-
up to 5.7 V) .....................................................16
Fig. 22.
Propagation RX to SX (SX pull-up to 3.3 V;
VCC = 3.3 V; RX pull-up to 4.6 V) .................. 17
Fig. 23.
Diode characteristic curve ...............................18
Fig. 24.
Transients generated by the bus wiring ...........19
Fig. 25.
Wiring transients limited by the diodes in
PCA9601 ......................................................... 20
Fig. 26.
Wiring transients limited by a Schottky
diode ................................................................21
Fig. 27.
Package outline SOT96-1 (SO8) .....................22
Fig. 28.
Package outline SOT505-1 (TSSOP8) ............23
Fig. 29.
Temperature profiles for large and small
components .....................................................26
PCA9601
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2022. All rights reserved.
Product data sheet
Rev. 3.1 — 4 January 2022
30 / 31



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31


датащи скачать

Go To PDF Page


ссылки URL



Вашему бизинису помогли Аллдатащит?  [ DONATE ] 

Что такое Аллдатащит   |   реклама   |   контакт   |   Конфиденциальность   |   Ссылка на техническое описание    |   обмен ссыками   |   поиск по производителю
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com