NXP Semiconductors

PCA9601

Dual bidirectional bus buffer

3 Applications

• Interface between I2C-buses operating at different logic levels (for example, 5 V and 3

V or 15 V)

• Interface between I2C-bus and SMBus (350 μA) standard or Fm+ standard

• Simple conversion of I2C-bus SDA or SCL signals to multi-drop differential bus

hardware, for example, via compatible PCA82C250

• Interfaces with opto-couplers to provide opto-isolation between I2C-bus nodes up to 1

MHz

• Long distance point-to-point or multipoint architectures

4 Ordering information

Package

Type number

Topside

marking

Name

Description

Version

PCA9601D

PCA9601

SO8

plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

PCA9601DP

9601

TSSOP8

plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1

Table 1. Ordering information

4.1 Ordering options

Type number

Orderable part

number

Package

Packing method [1]

Minimum order

quantity

Temperature

PCA9601D

PCA9601D,118

SO8

REEL 13" Q1/T1

*STANDARD MARK SMD

2500

Tamb = -40 °C to +85 °C

PCA9601DP,118

TSSOP8

REEL 13" Q1/T1

*STANDARD MARK SMD

2500

Tamb = -40 °C to +85 °C

PCA9601DP

PCA9601DPZ [2]

TSSOP8

REEL 13" Q1/T1 SSB [3]

2500

Tamb = -40 °C to +85 °C

Table 2. Ordering options

[1]

Standard packing quantities and other packaging data are available at www.nxp.com/packages/.

[2]

Orderable part number PCA9601DPZ is drop in alternate for PCA9601DP,118

[3]

This packing method uses a Static Shielding Bag (SSB) solution. Material should be kept in the sealed bag between uses.

5 Block diagram

PCA9601

SX (SDA)

RX (RxD, SDA)

SY (SCL)

TX (TxD, SDA)

TY (TxD, SCL)

GND

RY (RxD, SCL)

002aae873

VCC (2.5 V to 15 V)

8

1

7

4

3

2

5

6

static level offset

card side

higher drive,

longer distance side

Figure 1. Block diagram of PCA9601

PCA9601

All information provided in this document is subject to legal disclaimers.

© NXP B.V. 2022. All rights reserved.

Product data sheet

Rev. 3.1 — 4 January 2022

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