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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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TUSB1046AI-DCI датащи(PDF) 6 Page - Texas Instruments |
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TUSB1046AI-DCI датащи(HTML) 6 Page - Texas Instruments |
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6 / 48 page  6 TUSB1046A-DCI SLLSF13B – JUNE 2017 – REVISED MAY 2019 www.ti.com Product Folder Links: TUSB1046A-DCI Submit Documentation Feedback Copyright © 2017–2019, Texas Instruments Incorporated 6.5 Power Supply Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT PCC(ACTIVE-USB) Average active power USB Only Link in U0 with GEN2 data transmission. EN, EQ cntrl pins = NC, k28.5 pattern at 10 Gbps, VID = 1000 mVPP ; CTL1 = L; CTL0 = H 335 mW PCC(ACTIVE-USB-DP1) Average active power USB + 2 Lane DP Link in U0 with GEN2 data transmission. EN, EQ cntrl pins = NC, k28.5 pattern at 10 Gbps, VID = 1000 mVPP; CTL1 = H; CTL0 = H 634 mW PCC(ACTIVE--DP) Average active power 4 Lane DP Only Four active DP lanes operating at 8.1Gbps; CTL1 = H; CTL0 = L; 660 mW PCC(NC-USB) Average power with no connection No GEN1 device is connected to TXP/TXN; CTL1 = L; CTL0 = H; 2.4 mW PCC(U2U3) Average power in U2/U3 Link in U2 or U3 USB Mode Only; CTL1 = L; CTL0 = H; 3 mW PCC(SHUTDOWN) Device Shutdown CTL1 = L; CTL0 = L; I2C_EN = 0; 0.85 mW 6.6 DC Electrical Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 4-State CMOS Inputs(EQ[1:0], SSEQ[1:0], DPEQ[1:0], I2C_EN) IIH High level input current VCC = 3.6 V; VIN = 3.6 V 20 80 µA IIL Low level input current VCC = 3.6 V; VIN = 0 V –160 -40 µA 4-Level VTH Threshold 0 / R VCC = 3.3 V 0.55 V Threshold R/ Float VCC = 3.3 V 1.65 V Threshold Float / 1 VCC = 3.3 V 2.7 V RPU Internal pull-up resistance 35 kΩ RPD Internal pull-down resistance 95 kΩ 2-State CMOS Input (CTL0, CTL1, FLIP, CAD_SNK, HPDIN) CTL1, CTL0 and FLIP are Failsafe. VIH High-level input voltage 2 3.6 V VIL Low-level input voltage 0 0.8 V RPD Internal pull-down resistance for CTL1 500 k Ω R(ENPD) Internal pull-down resistance for CAD_SNK (pin 29), and HPDIN (pin 32) 150 k Ω IIH High-level input current VIN = 3.6 V –25 25 µA IIL Low-level input current VIN = GND, VCC = 3.6 V –25 25 µA I2C Control Pins SCL, SDA VIH High-level input voltage I2C_EN = 0 0.7 x V(I2C) 3.6 V VIL Low-level input voltage I2C_EN = 0 0 0.3 x V(I2C) V VOL Low-level output voltage I2C_EN = 0; IOL = 3 mA 0 0.4 V IOL Low-level output current I2C_EN = 0; VOL = 0.4 V 20 mA II(I2C) Input current on SDA pin 0.1 x V(I2C) < Input voltage < 3.3 V –10 10 µA CI(I2C) Input capacitance 10 pF C(I2C_FM+_BUS) I2C bus capacitance for FM+ (1MHz) 150 pF C(I2C_FM_BUS) I2C bus capacitance for FM (400kHz) 150 pF R(EXT_I2C_FM+) External resistors on both SDA and SCL when operating at FM+ (1MHz) C(I2C_FM+_BUS) = 150 pF 620 820 910 Ω R(EXT_I2C_FM) External resistors on both SDA and SCL when operating at FM (400kHz) C(I2C_FM_BUS) = 150 pF 620 1500 2200 Ω |
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